tag: GlobalFoundries

Here Comes 7nm
By Ed Sperling - 09 Jul, 2015 - Comments: 0

A consortium of companies involving IBM, GlobalFoundries and Samsung has rolled out the first 7nm test chip using silicon germanium as a substrate, using EUV to pattern multiple layers. While this doesn't mean the cost equation is even close to being solved, or that more than a handful of companies will push forward to that node anytime soon using SiGe as the substrate material, it does cre... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 02 Jul, 2015 - Comments: 0

GlobalFoundries completed its acquisition of IBM’s Microelectronics Group, creating a behemoth that is expected to extend well beyond the combined footprint of the existing companies. As part of the deal, GlobalFoundries will get two additional fabs, one of which makes RF SOI chips. But while IBM was hesitant to expand that business by adding new fab capacity, GlobalFoundries already has t... » read more

GF Closes On IBM Chip Business Purchase
By Ann Mutschler - 01 Jul, 2015 - Comments: 0

By Ann Steffora Mutschler, Ed Sperling and Mark LaPedus GlobalFoundries completed its acquisition of IBM's Microelectronics Group today, creating a behemoth that is expected to extend well beyond the combined footprint of the existing companies. To begin with, GlobalFoundries will get two additional fabs, one of which makes RF SOI chips. But while IBM was hesitant to expand that business ... » read more

The Future Of Moore’s Law
By Ed Sperling - 29 Jun, 2015 - Comments: 1

Semiconductor Engineering sat down to discuss the future of Moore's Law with Jan Rabaey, Donald O. Pederson distinguished professor at [getentity id="22165" comment="UC Berkeley"]; Lucio Lanza, managing director of Lanza techVentures; Subramani Kengeri, vice president of advanced technology architecture at [getentity id="22819" comment="GlobalFoundries"]; Charlie Cheng, CEO of [getentity id="2... » read more

Intel Plus Altera
By Ed Sperling - 25 Jun, 2015 - Comments: 0

Since the Intel-Altera deal reached the handshake phase earlier this month, there have been a lot of theories being forwarded and a lot of questions being raised. And there have been very few answers, in part because the deal isn't finalized yet and in part because this marriage will take time to play out in the market—maybe years. But along with the GlobalFoundries-IBM pairing, this is th... » read more

DoD Scratches Its Head Over Foundry Security
By Brian Bailey - 25 Jun, 2015 - Comments: 1

When the GlobalFoundries deal with IBM to acquire its foundries closes, as it is slated to sometime during 2015, the U.S. Department of Defense has a small problem on its hands. Military programs no longer will have access to a trusted fab to manufacture semiconductors. How do you ensure that the foundry did not modify or alter your design, add backdoor access or implement a remote control mech... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 19 Jun, 2015 - Comments: 0

Since the global economic recession of 2008-2009, the IC industry has pared down older fab capacity. From 2009-2014, semiconductor manufacturers have closed or repurposed 83 wafer fabs, including a few 300mm plants, according to IC Insights. Are 3D DRAMs finally here? SK Hynix is shipping mass production volumes of its first-generation High Bandwidth Memory (HBM1). Samsung is also backing it... » read more

Is EUV Making Progress?
By Ann Mutschler - 18 Jun, 2015 - Comments: 4

By Ann Steffora Mutschler & Ed Sperling EUV has been promised for a couple of decades, counted on for at least three process nodes on the ITRS roadmap, and considered essential to chip manufacturing since 22nm. Billions of dollars have been invested in R&D, engineering teams from around the world have contributed to its development, and still serious problems persist. Just how close... » read more

Foundries Expand Planar Efforts
By Mark LaPedus - 18 Jun, 2015 - Comments: 0

Competition is heating up in the leading-edge foundry business, as vendors begin to ramp up their new 16nm/14nm finFET processes. But that’s not the only action in the foundry arena. They are also expanding their efforts in the leading-edge planar market by rolling out new 28nm and 22nm processes. On one front, TSMC is offering new 28nm variants, based on bulk CMOS technology. And on an... » read more

Getting Over Overlay
By Mark LaPedus - 18 Jun, 2015 - Comments: 0

Chipmakers continue to migrate to the next node, but there are signs that traditional IC scaling is slowing down. So what’s causing the slowdown? Or for that matter, what could ultimately undo [getkc id="74" comment="Moore's Law"]? It could be a combination of factors. To be sure, IC design costs and complexity are soaring at each node. Scaling challenges are also playing a role. And ov... » read more

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