3D IC Partitioning and Placement Method That Optimizes For Critical Paths (POSTECH)

By Technical Paper Link - 12 Sep, 2024 - Comments: 0

A new technical paper titled "TA3D: Timing-Aware 3D IC Partitioning and Placement by Optimizing the Critical Path" was published by researchers at Pohang University of Science and Technology and Baum Design Systems. Abstract "In the face of challenges posed by semiconductor scaling, 3D integration technology has emerged as a crucial solution to overcome the constraints of traditional 2D I... » read more

GNN-Based Pre-Silicon Power Side-Channel Analysis Framework At RTL Level

By Technical Paper Link - 16 Oct, 2023 - Comments: 0

A technical paper titled “SCAR: Power Side-Channel Analysis at RTL-Level” was published by researchers at University of Texas at Dallas, Technology Innovation Institute and University of Illinois Chicago. Abstract: "Power side-channel attacks exploit the dynamic power consumption of cryptographic operations to leak sensitive information of encryption hardware. Therefore, it is necessary t... » read more

Learning The AMS Circuit Representation From Layout Positions (UT Austin/ NVIDIA)

By Technical Paper Link - 15 Mar, 2023 - Comments: 0

A recent technical paper titled "TAG: Learning Circuit Spatial Embedding From Layouts" was published by researchers at UT Austin and NVIDIA. Abstract "Analog and mixed-signal (AMS) circuit designs still rely on human design expertise. Machine learning has been assisting circuit design automation by replacing human experience with artificial intelligence. This paper presents TAG, a new parad... » read more

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tag: GNN

3D IC Partitioning and Placement Method That Optimizes For Critical Paths (POSTECH)

GNN-Based Pre-Silicon Power Side-Channel Analysis Framework At RTL Level

Learning The AMS Circuit Representation From Layout Positions (UT Austin/ NVIDIA)

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tag: GNN

3D IC Partitioning and Placement Method That Optimizes For Critical Paths (POSTECH)

GNN-Based Pre-Silicon Power Side-Channel Analysis Framework At RTL Level

Learning The AMS Circuit Representation From Layout Positions (UT Austin/ NVIDIA)

Trending Articles

Shift Left Is The Tip Of The Iceberg

Hybrid Bonding Makes Strides Toward Manufacturability

Chiplets Make Progress Using Interconnects As Glue

2D Semiconductors Make Progress, But So Does Silicon

Chip Industry Week In Review

Knowledge Centers Entities, people and technologies explored

Related Articles

Shift Left Is The Tip Of The Iceberg

Partitioning In The Chiplet Era

3.5D: The Great Compromise

AI’s Role In Chip Design Widens, Drawing In New Startups

Key Technologies To Extend EUV To 14 Angstroms

What Comes After HBM For Chiplets

Memory Fundamentals For Engineers

Why Small Fab And Assembly Houses Are Thriving

Sponsors

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