Week in Review – IoT, Security, Autos

By Jeff Dorsch - 06 Sep, 2019 - Comments: 0

Products/Services Rambus entered an exclusive agreement to acquire the Silicon IP, Secure Protocols, and Provisioning business from Verimatrix, formerly known as Inside Secure. Financial terms were not revealed. The transaction is expected to close this year. Rambus will use the Verimatrix offerings in such demanding applications as artificial intelligence, automotive, the Internet of Things, ... » read more

New Twist On Scalable Electronics?

By Brian Fuller - 14 Mar, 2016 - Comments: 0

Snug in their tents at Everest base camp a few years ago, Matt Du Puy and his colleagues marveled at the howling snowstorm outside, until they peeked out and saw snow drifts piling up quickly. They made a quick decision to tug on their boots and seek safer ground. As they did, clutches of other campers emerged and fell in line, bleary-eyed refugees trudging through the darkness. “We got of... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 18 Dec, 2015 - Comments: 1

Samsung plans to make a major entry into the drone market, according to reports. “Samsung is not alone in focusing on the drone market,” said Will Strauss, president of Forward Concepts, in a research note. “At CES next month in Las Vegas, one can expect new products from drone market leader DJI, but dozens of new drone models from Parrot and many other companies. Even GoPro chip maker A... » read more

Week 13: Cruising The Deep Submicron

By Anne Cirkel - 05 Sep, 2014 - Comments: 1

These cooler, shorter days can only mean one thing: It’s time to get in the last beautiful late summer, early autumn motorcycle rides. Surprised? Well, I ride a 2005 Harley Davidson Dyna Low Rider. I’m a picky rider who prefers the kind of perfect weather conditions that have prevailed in Oregon during the last few weekends. Here is a little clip from a recent tour around Crater Lake in sou... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: GoPro

Week in Review – IoT, Security, Autos

New Twist On Scalable Electronics?

The Week In Review: Manufacturing

Week 13: Cruising The Deep Submicron

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Entities, people and technologies explored