Using Formal For RISC-V Security

By Ed Sperling - 19 Nov, 2024 - Comments: 0

Finding and closing up security holes is becoming more important as chips are used in safety- and mission-critical applications, but it's increasingly important for chips designed for much less costly devices, where the selling price typically doesn't warrant a significant investment in security. The problem is these devices are connected to some of the same networks, and any access points for ... » read more

Systems-in-Package: Authenticated Partial Encryption Protocol For Secure Testing (U. of Florida)

By Technical Paper Link - 12 Nov, 2024 - Comments: 0

A new technical paper titled "GATE-SiP: Enabling Authenticated Encryption Testing in Systems-in-Package" was published by researchers at University of Florida and University of Central Florida. Abstract: "A heterogeneous integrated system in package (SIP) system integrates chiplets outsourced from different vendors into the same substrate for better performance. However, during post-integra... » read more

Effectiveness of Hardware Fuzzing In Detecting Memory Vulnerabilities

By Technical Paper Link - 08 Nov, 2024 - Comments: 0

A new technical paper titled "Fuzzerfly Effect: Hardware Fuzzing for Memory Safety" was published by researchers at Technical University of Darmstadt, Texas A&M University and Delft University of Technology. Abstract: "Hardware-level memory vulnerabilities severely threaten computing systems. However, hardware patching is inefficient or difficult post-fabrication. We investigate the eff... » read more

Democratizing Roots of Trust from Silicon to Software

By Synopsys - 07 Nov, 2024 - Comments: 0

With a vast amount of devices getting connected to the Internet of Things (IoT) and the growing number of low-cost attacks being developed to hack such IoT devices, it is clear that the need for embedded security solutions is rising dramatically. A security subsystem in the main system-on-chip (SoC) of a device can be deployed to offer secure cryptographic services to the applications running o... » read more

Pre-Silicon Verification Method Addressing Critical Aspects of Speculative Execution Vulnerability Detection

By Technical Paper Link - 04 Nov, 2024 - Comments: 0

A new technical paper titled "Lost and Found in Speculation: Hybrid Speculative Vulnerability Detection" was published by researchers at Technical University of Darmstadt and Texas A&M University. "We introduce Specure, a novel pre-silicon verification method composing hardware fuzzing with Information Flow Tracking (IFT) to address speculative execution leakages. Integrating IFT enables two... » read more

FPGA Fault Injection Attacks (ASU, KIT)

By Technical Paper Link - 29 Oct, 2024 - Comments: 0

A new technical paper titled "Hacking the Fabric: Targeting Partial Reconfiguration for Fault Injection in FPGA Fabrics" was published by researchers at Arizona State University and Karlsruhe Institute of Technology (KIT). Abstract "FPGAs are now ubiquitous in cloud computing infrastructures and reconfigurable system-on-chip, particularly for AI acceleration. Major cloud service providers s... » read more

The Growing Imperative Of Hardware Security Assurance In IP And SoC Design

By Pavani Jella - 24 Oct, 2024 - Comments: 0

In an era where technology permeates every aspect of our lives, the semiconductor industry serves as the backbone of innovation. From IoT devices to data centers, every piece of technology relies on integrated circuits (ICs) such as intellectual property (IP) cores and system on chips (SoCs). As these technologies become increasingly pervasive, the importance of hardware security assurance in t... » read more

Overview Of Security Verification Methodologies for SoC Designs Pre-Silicon (U. of Florida)

By Technical Paper Link - 23 Oct, 2024 - Comments: 0

A technical paper titled "A Survey on SoC Security Verification Methods at the Pre-silicon Stage" was recently published by researchers at University of Florida. Abstract "This paper presents a survey of the state-of-the-art pre-silicon security verification techniques for System-on-Chip (SoC) designs, focusing on ensuring that designs, implemented in hardware description languages (HDLs) a... » read more

LLMs Show Promise In Secure IC Design

By Adam Kovac - 21 Oct, 2024 - Comments: 0

The introduction of large language models into the EDA flow could significantly reduce the time, effort, and cost of designing secure chips and systems, but they also could open the door to more sophisticated attacks. It's still early days for the use of LLMs in chip and system design. The technology is just beginning to be implemented, and there are numerous technical challenges that must b... » read more

Securing Advanced Packaging Supply Chain With Inherent HW Identifiers Using Imaging Techniques

By Technical Paper Link - 14 Oct, 2024 - Comments: 0

A new technical paper titled "Fault-marking: defect-pattern leveraged inherent fingerprinting of advanced IC package with thermoreflectance imaging" was published by researchers at University of Florida and University of Cincinnati. "This work visits the existing challenges and limitations of traditional embedded fingerprinting and watermarking approaches, and proposes the notion of inherent... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?