Silicon Lifecycle Management


How do you track, measure and ensure reliability over the lifetime of a chip, regardless of how or where it is used? Steve Pateras, senior director of marketing for test products at Synopsys, drills down into the impact of hardware-software co-design, over-the-air updates, the expected lifetime of designs, and how the various monitors and sensors are used to track environmental, structural and ... » read more

Faster Inferencing At The Edge


Cheng Wang, senior vice president of engineering at Flex Logix, talks about inferencing at the edge, what are some of the main considerations in designing and choosing an inferencing chip, why programmability and modularity are important, and how hardware-software co-design with algorithms can improve performance and power. » read more

Getting Particular About Partitioning


Partitioning could well be one of the most important and pervasive trends since the invention of computers. It has been around for almost as long, too. The idea dates back at least as far back as the Manhattan Project during World War II, when computations were wrapped within computations. It continued from there with what we know as time-sharing, which rather crudely partitioned access by p... » read more

Customization And Limitations At The Edge


Semiconductor Engineering sat down to discuss the edge constraints and the need for security with Jeff DeAngelis, managing director of the Industrial and Healthcare Business Unit at Maxim Integrated; Norman Chang, chief technologist at Ansys; Andrew Grant, senior director of artificial intelligence at Imagination Technologies; Thomas Ensergueix, senior director of the automotive and IoT line of... » read more

Rethinking Architectures Based On Power


The newest chips being developed for everything from the cloud to the edge of the network look nothing like designs of even a year or two ago. They are architected for speed, from the throughput of high-speed buses and external interconnects to the customized accelerators and arrays of redundant MACs. But many of these designs have barely scratched the surface for saving power, which will becom... » read more

Scaling At The Angstrom Level


It now appears likely that 2nm will happen, and possibly the next node or two beyond that. What isn't clear is what those chips will be used for, by whom, and what they ultimately will look like. The uncertainty isn't about the technical challenges. The semiconductor industry understands the implications of every step of the manufacturing process down to the sub-nanometer level, including ho... » read more

Tracking Automotive’s Rapidly Shifting Ecosystem


The automotive ecosystem is becoming much harder to navigate as automakers, Tier 1s and IP vendors redefine their relationships based upon shifting value caused by an rapidly expanding amount of increasingly interdependent and complex electronic content. Predictions of massive change started almost a decade ago with a number of pilot programs around autonomous vehicles. But those shifts real... » read more

Into The Cold And Darkness


The need for speed is limitless. There is far more data to process, and there is competition on a global scale to process it fastest and most efficiently. But how to achieve future revs of improvements will begin to look very different from the past. For one thing, the new criteria for that speed are frequently tied to a fixed or shrinking power budget. This is why many benchmarks these days... » read more

A New Dawn For IP


The IP industry is changing again. The concept started as build once, use everywhere, but today it is more like architect once, customize everywhere. Few designs can afford sub-optimal IP for their application. The need for customized IP is driven by both leading-edge designs and the trailing markets, although for different reasons. While this customization is causing IP companies to transfo... » read more

Hardware-Software Co-Design Reappears


The core concepts in hardware-software co-design are getting another look, nearly two decades after this approach was first introduced and failed to catch on. What's different this time around is the growing complexity and an emphasis on architectural improvements, as well as device scaling, particularly for AI/ML applications. Software is a critical component, and the more tightly integrate... » read more

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