System Bits: Sept. 23

By Ann Mutschler - 23 Sep, 2014 - Comments: 0

Contender emerges for 3D IC semiconductor material While silicon has few serious competitors as the material of choice in the electronics industry, transistors cannot keep shrinking to meet the needs of next-gen devices given the significant physical limitations of energy consumption and heat dissipation. To address this, researchers at Harvard University have achieved a reversible change in e... » read more

System Bits: Dec. 17

By Ann Mutschler - 17 Dec, 2013 - Comments: 0

Simple, Inexpensive Graphene Treatment Could Unleash New Uses To help realize the promise of graphene in electronics, solar power, and sensors, researchers from MIT and UC Berkeley have created what they said is a simple, inexpensive treatment that they believe may help realize the potential of the material. While pure graphene lacks some key properties needed for electronic devices, modify... » read more

Manufacturing Bits: July 16

By Mark LaPedus - 16 Jul, 2013 - Comments: 0

Photon Chips Harvard University, the Massachusetts Institute of Technology (MIT) and the Vienna University of Technology have devised an all-optical transistor controlled by a single photon. The optical transistor could enable the development of photonic quantum gates and deterministic multi-photon entanglement. For years, researchers have been looking to develop an optical transistor, whe... » read more

Power/Performance Bits: July 9

By Ed Sperling - 09 Jul, 2013 - Comments: 0

All-optical transistor Optical computing uses light rather than electricity to perform calculations and is expected to potentially pay dividends for both conventional computers and quantum computers, which are largely hypothetical devices that could perform some types of computations exponentially faster than classical computers. One drawback is that optical computing requires light particl... » read more

Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Harvard University

System Bits: Sept. 23

System Bits: Dec. 17

Manufacturing Bits: July 16

Power/Performance Bits: July 9