Week In Review: Manufacturing, Test

By Mark LaPedus - 31 Jul, 2020 - Comments: 0

Chipmakers and OEMs As reported, Intel this week reorganized its operations following delays with its 7nm technology. Intel is behind TSMC and Samsung in technology. As a result, TSMC’s foundry customers, such as AMD, Nvidia and others, are also pulling ahead of Intel. In addition, reports have surfaced that Intel will outsource some of its leading-edge chip production to TSMC. To solve t... » read more

Blog Review: Nov. 7

By Jesse Allen - 07 Nov, 2018 - Comments: 0

Arm's Shidhartha Das looks into maximizing the benefits of power delivery networks and explains a non-intrusive technique using an on-chip digital storage oscilloscope that can directly sample the power-rails to probe potential runtime bugs due to power delivery weaknesses. Synopsys' Snigdha Dua argues that scrambling is one of the most important features introduced in HDMI 2.0 and takes a l... » read more

HDMI 2.1 For A More Immersive Viewing Experience

By Hezi Saar - 12 Apr, 2018 - Comments: 0

With the advent of richer television and gaming content, consumers’ expectations have gone from ultra-high-resolution 4K displays to 10K with finer image details, more color gamut, and higher bandwidth. To deliver premium content to digital televisions and trending HDMI-based mobile devices, the HDMI Forum recently announced the HDMI specification, version 2.1. The re-architected HDMI 2.1 off... » read more

The Week In Review: Design

By Jesse Allen - 02 Sep, 2016 - Comments: 0

Memory Nantero licensed its technology for non-volatile RAM using carbon nanotubes (NRAM) to Fujitsu Semiconductor and Mie Fujitsu Semiconductor, which plan to conduct joint development towards releasing a product based on 55-nm process technology. Fujitsu Semiconductor plans to develop an NRAM-embedded custom LSI product by the end of 2018. IP Flex Logix completed design of a family o... » read more

Using Automotive-Ready IP To Accelerate SoC Development

By Ron DiGiuseppe - 13 Aug, 2015 - Comments: 0

IP suppliers play a key role in the automotive supply chain to enable high-performance advanced driver assistance system (ADAS) SoCs. Vision-based SoCs may contain a high amount of third-party IP to implement the key embedded vision, sensor fusion, multimedia, security and advanced connectivity functions. And while IP suppliers have permeated the semiconductor ecosystem for consumer, mobile, PC... » read more

IP Integration Challenges Increase

By Ed Sperling - 16 Jun, 2015 - Comments: 0

Semiconductor Engineering sat down with Chris Rowen, CTO of [getentity id="22032" e_name="Cadence"]'s IP group; Rob Aitken, an [getentity id="22186" comment="ARM"] fellow; Patrick Soheili, vice president of product management and corporate development at [getentity id="22242" e_name="eSilicon"]; Navraj Nandra, senior director of marketing for DesignWare analog and mixed-signal IP at [getentity ... » read more

How Secure Is Your SoC?

By Ed Sperling - 07 Aug, 2013 - Comments: 0

The Russian Federal Guard Service’s decision to revert to typewriters—machines that leave unique mechanical fingerprints—is a good indicator of just how serious security has become in a world dominated by electronics and pervasive connectivity. What’s less apparent is the growing threat at the SoC level—inside complex chips, between the chip and the board, and between chips on the ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer