New Approaches For Dealing With Thermal Problems


New thermal monitoring, simulation and analysis techniques are beginning to coalesce in chips developed at leading-edge nodes and in advanced packages in order to keep those devices running at optimal temperatures. This is particularly important in applications such as AI, automotive, data centers and 5G. Heat can kill a chip, but it also can cause more subtle effects such as premature aging... » read more

HBM Issues In AI Systems


All systems face limitations, and as one limitation is removed, another is revealed that had remained hidden. It is highly likely that this game of Whac-A-Mole will play out in AI systems that employ high-bandwidth memory (HBM). Most systems are limited by memory bandwidth. Compute systems in general have maintained an increase in memory interface performance that barely matches the gains in... » read more

Thermal Challenges In Advanced Packaging


CT Kao, product management director at Cadence, talks with Semiconductor Engineering about why packaging is so complicated, why power and heat vary with different use cases and over time, and why a realistic power map is essential particularly for AI chips, where some circuits are always on.   Interested in more Semiconductor Engineering videos? Sign-up for our YouTube channel here » read more

Finding Hotspots In AI Chips


Things are getting far more complicated as we move down to 7nm & 5nm but the tolerances of some of the physical effects that we have been measuring in the past are much tighter than they were at the older nodes. How do we track all that? What we see is that as we descend through the advanced nodes, say from 16nm down to 12nm, 7nm and more recently 5nm, we see that gate density starts to ... » read more

Thermal Challenges And Moore’s Law


Steven Woo, fellow and distinguished inventor at Rambus, looks at the evolution of graphics cards over a couple of decades and how designs changed to deal with more graphics and more heat, and why smaller, faster and cheaper doesn’t apply in this market. » read more

3D Power Delivery


Getting power into and around a chip is becoming a lot more difficult due to increasing power density, but 2.5D and 3D integration are pushing those problems to whole new levels. The problems may even be worse with new packaging approaches, such as chiplets, because they constrain how problems can be analyzed and solved. Add to that list issues around new fabrication technologies and an emph... » read more

GDDR6 – HBM2 Tradeoffs


Steven Woo, Rambus fellow and distinguished inventor, talks about why designers choose one memory type over another. Applications for each were clearly delineated in the past, but the lines are starting to blur. Nevertheless, tradeoffs remain around complexity, cost, performance, and power efficiency.   Related Video Latency Under Load: HBM2 vs. GDDR6 Why data traffic and bandw... » read more

The Growing Challenge Of Thermal Guard-Banding


Guard-banding for heat is becoming more difficult as chips are used across a variety of new and existing applications, forcing chipmakers to architect their way through increasingly complex interactions. Chips are designed to operate at certain temperatures, and it is common practice to develop designs with some margin to ensure correct functionality and performance throughout the operat... » read more

Making Sense Of DRAM


Graham Allan, senior manager for product marketing at Synopsys, examines the different types of DRAM, from GDDR to HBM, which markets they’re used in, and why there is such disparity between them. https://youtu.be/ynvcPfD2cZU     __________________________________ See more tech talk videos here. » read more

Power/Performance Bits: Sept. 25


Heat transfer in 2D materials Engineers at the University of Illinois developed a way to reduce overheating in nanoelectronics that incorporate 2D components by adding another layer to the structure. "In the field of nanoelectronics, the poor heat dissipation of 2D materials has been a bottleneck to fully realizing their potential in enabling the manufacture of ever-smaller electronics whil... » read more

← Older posts