tag: Helic

Electromagnetic Crosstalk Considerations In Low Power Designs
By Magdy Abadir - 19 May, 2018 - Comments: 0

By Magdy Abadir, Padelis Papadopoulos, and Yehea Ismail
 Power consumption continues to be a critical design metric in high-performance mobile electronics. In order to meet the aggressive power budget targets, chips today need to operate at extremely low power levels, which increases the critical signals’ susceptibility to electromagnetic (EM) crosstalk effects. Because a low-power So... » read more

Power Optimization Strategies Widen
By Brian Bailey - 10 May, 2018 - Comments: 0

An increasing amount of electronic content in new and existing markets is creating different and sometimes competing demands for power optimization. For the past decade, EDA has been driven by the mobile phone industry, where the emphasis is on better power analysis and optimization tools to reduce power consumption and extend battery life. While energy efficiency continues to improve, other... » read more

Designing 5G Chips
By Ann Mutschler - 18 Apr, 2018 - Comments: 0

5G is the wireless technology of the future, and it’s coming fast. The technology boasts very high-speed data transfer rates, much lower latency than 4G LTE, and the ability to handle significantly higher densities of devices per cell site. In short, it is the best technology for the massive amount of data that will be generated by sensors in cars, IoT devices, and a growing list of next-g... » read more

IP Electromagnetic Crosstalk Requires Contextual Signoff
By Magdy Abadir - 16 Apr, 2018 - Comments: 0

By Magdy Abadir and Anand Raman Continuous advancement in technology scaling is enabling the emergence of high-performance application markets such as artificial intelligence, autonomous cars and 5G communication. These electronic systems operate at multi-GHz speed, while consuming the lowest amount of power possible leaving very little margin for error. Chips in these systems are highly in... » read more

High-Performance Memory Challenges
By Ann Mutschler - 12 Apr, 2018 - Comments: 1

Designing memories for high-performance applications is becoming far more complex at 7/5nm. There are more factors to consider, more bottlenecks to contend with, and more tradeoffs required to solve them. One of the biggest challenges is the sheer volume of data that needs to be processed for AI, machine learning or deep learning, or even in classic data center server racks. “The design... » read more

Tech Talk: 7/5/3nm Signoff
By Ed Sperling - 12 Apr, 2018 - Comments: 0

Anand Raman, director of technical marketing at Helic, explains what's needed to improve confidence in designs at the most advanced process nodes. https://youtu.be/2O2pbMJSta4 » read more

New Shifts In Automotive Design
By Ann Mutschler - 05 Apr, 2018 - Comments: 1

Four big shifts in automotive design and usage are beginning to converge—electrification, increasing connectivity, autonomous driving and car sharing—creating a ripple effect across the automotive electronics supply chain. Over the past few years the electronic content of cars and other vehicles has surged, with electrical systems replacing traditional mechanical and electro-mechanical s... » read more

Why Inductance Is Good for Area, Power and Performance
By Magdy Abadir - 12 Mar, 2018 - Comments: 0

By Magdy Abadir and Yehea Ismail For chips designed at advanced technology nodes, interconnect is the dominant contributor towards delay, power consumption, and reliability. Major interconnects such as clock trees, power distribution networks and wide buses play a significant role in chip failure mechanisms such as jitter, noise coupling, power distribution droops, and electro-migration. ... » read more

New Issues In Advanced Packaging
By Ann Mutschler - 08 Mar, 2018 - Comments: 1

Advanced packaging is gaining in popularity as the cost and complexity of integrating everything onto a planar SoC becomes more difficult and costly at each new node, but ensuring that these packaged die function properly and yield sufficiently isn't so simple. There are a number of factors that are tilting more of the the semiconductor industry toward advanced [getkc id="27" kc_name="packag... » read more

Symptoms Of SoC Electromagnetic (EM) Crosstalk
By Anand Raman - 14 Feb, 2018 - Comments: 0

By Anand Raman and Magdy Abadir Have you ever had your silicon demonstrate unexpected behavior? Have you ever found unexplainable design failure or performance degradation? A number of issues could be the culprit - from overloaded signal nets, a noisy power grid, or increasing temperature - but one problem often overlooked is electromagnetic (EM) crosstalk. Electromagnetic (EM) crosstal... » read more

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