tag: Helic

SoC Electromagnetic Crosstalk: From A Tool Perspective
By Magdy Abadir - 14 Dec, 2017 - Comments: 0

Most commercial electromagnetic (EM) solvers are limited by the size of the design that they can handle, or they may take a very large amount of time or memory to perform the task. These capacity, memory or runtime constraints often lead to dropping important details about the design and the surrounding environment, which in many cases can mask the effects of EM crosstalk, or can lead to the wr... » read more

Electromagnetic (EM) Crosstalk Analysis: Unlocking the Mystery
By Magdy Abadir - 09 Nov, 2017 - Comments: 0

Ignoring electromagnetic crosstalk is highly risky and can cause significant time-to-market delays as well significant cost over runs. Most current SoC design flows fundamentally ignore inductance and EM effects, and the term “EM crosstalk analysis” may sound Greek to them. This short article provides a quick overview of the basic steps involved in doing EM crosstalk analysis as part of an ... » read more

Lots Of Little Knobs For Power
By Ann Mutschler - 09 Nov, 2017 - Comments: 3

Dynamic power is becoming a much bigger worry at new nodes as more finFETs are packed on a die and wires shrink to the point where resistance and capacitance become first-order effects. Chipmakers began seeing dynamic power density issues with the first generation of [getkc id="185" kc_name="finFETs"]. While the 3D transistor structures reduced leakage current by providing better gate contro... » read more

Challenges And Trends In SoC Electromagnetic (EM) Crosstalk
By Helic - 08 Nov, 2017 - Comments: 0

Electromagnetic Crosstalk analysis is emerging as a fundamental necessity as a component of electronic system development. With the advent of advanced technologies and System on-Chip (SoC) architectures, ignoring electromagnetic crosstalk is highly risky resulting in significant delays in reaching the market on time as well significant cost over runs. This paper provides an overview of the stat... » read more

New Power Concerns At 10/7nm
By Ann Mutschler - 16 Oct, 2017 - Comments: 1

As chip sizes and complexity continues to grow exponentially at 7nm and below, managing power is becoming much more difficult. There are a number of factors that come into play at advanced nodes, including more and different types of processors, more chip-package decisions, and more susceptibility to noise of all sorts due to thinner insulation layers and wires. The result is that engineers ... » read more

Crosstalk Analysis At 7nm
By Magdy Abadir - 12 Oct, 2017 - Comments: 0

The increasing demand for electronic systems with increasing bandwidth and decreasing size puts more high-speed circuitry and high bandwidth channels in ever-closer proximity. The continuous increase in internal clock frequencies (e.g. 5 - 10 GHz) and the increase in data rates (e.g. >10Gbps) are fueling the emergence of electromagnetic (EM) crosstalk issues. Parasitic inductance and indu... » read more

Noise Abatement
By Brian Bailey - 12 Oct, 2017 - Comments: 0

[getkc id="285" kc_name="Noise"] is a fact of life. Almost everything we do creates noise as a by-product and quite often what is a signal to one party is noise to another. Noise cannot be eliminated. It must be managed. But is noise becoming a larger issue in chips as the technology nodes get smaller and packaging becomes more complex? For some, the answer is a very strong yes, while for ot... » read more

Noise Issues At 10nm And Below
By Magdy Abadir - 14 Sep, 2017 - Comments: 0

Most of the conversations below 10nm have been about lithography, materials and design constraints. But as companies push to 7nm and beyond, they are faced with a host of new challenges, including how to deal with electromagnetic crosstalk. Electromagnetic crosstalk is unwanted interference caused by the electric and magnetic fields of one or more signals (aggressors) affecting another sign... » read more

Multi-Physics Combats Commoditization
By Brian Bailey - 14 Sep, 2017 - Comments: 0

The semiconductor industry has benefited greatly from developments around digital circuitry. Circuits have grown in size from a few logic gates in the 1980s to well over 1 billion today. In comparison, analog circuits have increased in size by a factor of 10. The primary reason is that digital logic managed to isolate many of the physical effects from functionality, and to provide abstractions ... » read more

A Guide To Advanced Process Design Kits
By Ernest Worthman - 14 Apr, 2014 - Comments: 1

The increasing complexity of design enablement has prompted manufacturers to optimize the design process. New tools and techniques, thanks to next-generation hardware and software, have provided a new platform for semiconductor and wafer design. Advanced PDKs are the solution and have been developed by foundries to optimize the design process and leverage and reuse intellectual property (IP) an... » read more

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