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Research Bits: April 5


Creating qubits in bulk Researchers from Intel and QuTech, an institute of the Delft University of Technology and the Netherlands Organisation for Applied Scientific Research (TNO), built a qubit using standard semiconductor manufacturing facilities. The qubit is based on the spin of single electrons that are captured in a silicon nanoscale device, which resembles conventional transistors. ... » read more

Hybrid architecture based on two-dimensional memristor crossbar array and CMOS integrated circuit for edge computing


Abstract "The fabrication of integrated circuits (ICs) employing two-dimensional (2D) materials is a major goal of semiconductor industry for the next decade, as it may allow the extension of the Moore’s law, aids in in-memory computing and enables the fabrication of advanced devices beyond conventional complementary metal-oxide-semiconductor (CMOS) technology. However, most circuital demons... » read more

Power/Performance Bits: Aug. 9


Capacitors in interposers Scientists at Tokyo Institute of Technology developed a 3D functional interposer containing an embedded capacitor. They tout the design as saving package area and reducing wiring length, resulting in less noise and power consumption. The capacitive elements are embedded inside a 300mm silicon piece using permanent adhesive and mold resin. The interconnects between ... » read more

Power/Performance Bits: Feb. 25


Thinner, flexible touchscreens Researchers from RMIT University, University of New South Wales, and Monash University developed a thin, flexible electronic material for touchscreens. The material is 100 times thinner than current touchscreen materials. The new screens are still based on indium-tin oxide (ITO), a common touchscreen material. However, a liquid metal printing approach was used... » read more