tag: high-bandwidth memory

Choosing The Right Memory Solution For AI Accelerators
By Tim Messegee - 16 Jan, 2025 - Comments: 0

To meet the increasing demands of AI workloads, memory solutions must deliver ever-increasing performance in bandwidth, capacity, and efficiency. From the training of massive large language models (LLMs) to efficient inference on endpoint devices, choosing the right memory technology is critical for chip designers. This blog explores three leading memory solutions—HBM, LPDDR, and GDDR—and t... » read more

Redefining XPU Memory For AI Data Centers Through Custom HBM4: Part 3
By Archana Cheruliyil - 19 Dec, 2024 - Comments: 0

This is the third and final of a series from Alphawave Semi on HBM4 and gives and examines custom HBM implementations. Click here for part 1, which gives an overview of the HBM standard, and here for part 2, on HBM implementation challenges. This follows on from our second blog, where we discussed the substantial improvements high bandwidth memory (HBM) provides over traditional memory tec... » read more

Redefining XPU Memory For AI Data Centers Through Custom HBM4: Part 2
By Archana Cheruliyil - 09 Dec, 2024 - Comments: 0

This is the second in a three-part series from Alphawave Semi on HBM4 and gives insights into HBM implementation challenges. Click here for part 1, for an overview on HBM, and in part 3, we will introduce details of a custom HBM implementation. Implementing a 2.5D System-in-Package (SiP) with High Bandwidth Memory (HBM) is a complex process that spans across architecture definition, designi... » read more

Redefining XPU Memory For AI Data Centers Through Custom HBM4: Part 1
By Archana Cheruliyil - 26 Nov, 2024 - Comments: 1

This is the first of a three-part series on HBM4 and gives an overview of the HBM standard. Part 2 will provide insights on HBM implementation challenges, and part 3 will introduce the concept of a custom HBM implementation. Relentless growth in data consumption Recent advances in deep learning have had a transformative effect on artificial intelligence (AI) and the ever-increasing volume of ... » read more

HBM Options Increase As AI Demand Soars
By Laura Peters - 21 Nov, 2024 - Comments: 0

High-bandwidth memory (HBM) sales are spiking as the amount of data that needs to be processed quickly by state-of-the-art AI accelerators, graphic processing units, and high-performance computing applications continues to explode. HBM inventories are sold out, driven by massive efforts and investments in developing and improving large language models such as ChatGPT. HBM is the memory of ch... » read more

A New Generation Of 7400 Socket
By Brian Bailey - 29 Aug, 2024 - Comments: 0

When I was 18, and just been accepted at Brunel University in West London to start my undergraduate degree in electrical and electronic engineering, I sent off a letter to Texas Instruments telling them about the journey ahead of me and asked if they could they send me a copy of their TTL Data Book. A few weeks later a package arrived and there it was. This incredible brown/orange book, thicker... » read more

HBM3E: All About Bandwidth
By Frank Ferro - 08 Aug, 2024 - Comments: 0

The rapid rise in size and sophistication of AI/ML training models requires increasingly powerful hardware deployed in the data center and at the network edge. This growth in complexity and data stresses the existing infrastructure, driving the need for new and innovative processor architectures and associated memory subsystems. For example, even GPT-3 at 175 billion parameters is stressing the... » read more

Are You Ready For HBM4? A Silicon Lifecycle Management (SLM) Perspective
By Faisal Goriawalla - 06 Aug, 2024 - Comments: 0

Many factors are driving system-on-chip (SoC) developers to adopt multi-die technology, in which multiple dies are stacked in a three-dimensional (3D) configuration. Multi-die systems may make power and thermal issues more complex, and they have required major innovations in electronic design automation (EDA) implementation and test tools. These challenges are more than offset by the advantages... » read more

What’s Missing In 2.5D EDA Tools
By Brian Bailey - 28 Mar, 2024 - Comments: 0

Gaps in EDA tool chains for 2.5D designs are limiting the adoption of this advanced packaging approach, which so far has been largely confined to high-performance computing. But as the rest of the chip industry begins migrating toward advanced packaging and chiplets, the EDA industry is starting to change direction. There are learning periods with all new technologies, and 2.5D advanced pack... » read more

Enabling Scalable Accelerator Design On Distributed HBM-FPGAs (UCLA)
By Technical Paper Link - 06 Dec, 2023 - Comments: 0

A technical paper titled “TAPA-CS: Enabling Scalable Accelerator Design on Distributed HBM-FPGAs” was published by researchers at University of California Los Angeles. Abstract: "Despite the increasing adoption of Field-Programmable Gate Arrays (FPGAs) in compute clouds, there remains a significant gap in programming tools and abstractions which can leverage network-connected, cloud-scale... » read more

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