tag: high-bandwidth memory

Will There Be A DDR5?
By Ed Sperling - 10 Oct, 2014 - Comments: 1

DDR4 rollouts have begun. And in the DRAM world that begs the question, 'What comes next?' The answer isn't so obvious. While there have been suggestions inside of JEDEC — the Joint Electron Device Engineering Council, which has overseen the standards for double-data-rate synchronous DRAM — to develop a DDR5 standard, it's not the only solution being considered. And in the minds of some... » read more

Driving Memory Beyond DDR4
By Frank Ferro - 09 Oct, 2014 - Comments: 0

While attending recent technology trade shows, the Intel Developer’s Forum (IDF) in August and last week’s ARM TechCon, I participated in many interesting discussions around server performance, power consumption, memory bandwidth and capacity. The race to introduce higher-performing servers that consume less power is fueled by the growing demand for new applications in the enterprise, commu... » read more

Stacked Die Politics, Technology And Tools
By Ed Sperling - 08 Sep, 2014 - Comments: 0

The path to stacking die may look fairly straightforward, but reality is somewhat different. There is a battle raging between foundries and OSATs over who will actually stack and package the die. There is new technology being created that could change the economics of how these die go together. And there is debate about just how ready the tools are to make all of this happen. All of this is ... » read more

Different Approaches Emerge For Stacking Die
By Ed Sperling - 21 Aug, 2014 - Comments: 1

The concept of stacking die to shorten wires, improve performance, and reduce the amount of energy required to drive signals has been in research for at least the past dozen years at both IBM and Intel. And depending upon whom you ask, it could be another 2 to 10 years before it becomes a mainstream packaging approach—if it happens at all. At least part of the confusion stems from how you ... » read more

What’s Next For Memory?
By Mark LaPedus - 14 Aug, 2014 - Comments: 4

Apple, Samsung and others are developing the next wave of smartphones and tablets. OEMs want to integrate new memory schemes that provide more bandwidth at lower power. But there are some challenges in the arena that are prompting memory makers to rethink their mobile DRAM roadmaps. The conventional wisdom was that memory makers would ship mobile DRAMs based on the new LPDDR4 interface stand... » read more

Tougher Memory Choices
By Brian Bailey - 23 Jun, 2014 - Comments: 1

In part 1 of this roundtable, the participants talked about the investments being made in memory technologies, the role that memories play in system security and the tools support for optimizing memory architecture. Taking part in the conversation are Herbert Gebhart vice president of interface and system solutions in the Memory and Interfaces Division of Rambus, Bernard Murphy, chief technolog... » read more

Power Moves Up To First Place
By Ed Sperling - 10 Apr, 2014 - Comments: 2

Virtually every presentation delivered about semiconductor design or manufacturing these days—and every end product specification that uses advanced technology—incorporates some reference to power and/or energy. It has emerged as the most persistent, most problematic, and certainly the most talked about issue from conception to marketplace adoption. And the conversation only grows louder... » read more

3D IC Supply Chain: Still Under Construction
By Barbara Jorgensen - 25 Jul, 2013 - Comments: 1

By Barbara Jorgensen and Ed Sperling Stacked die, which promise high levels of integration, a tiny footprint, energy conservation and blinding speed, still have some big hurdles to overcome. Cost, packaging and manufacturability continue to make steady progress, with test chips being produced by all of the major foundries. But in a disaggregated ecosystem, the supply chain remains a big st... » read more

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