Week In Review: Design, Low Power


M&A eSilicon will be acquired by Inphi Corporation and Synopsys. Inphi is acquiring the majority of the company, including the ASIC business and 56/112G SerDes design and related IP, for $216 million in both cash and the assumption of debt. Inphi expects to combine its DSP, TiA, Driver and SiPho products with eSilicon’s 2.5D packaging and custom silicon design capabilities for electro-optics... » read more

Big Push For 3D Sensing With iPhone X


3D sensing is a buzzword that has been thrown around quite a bit this year in connection with the rumors surrounding the tenth-anniversary iPhone. Although the iPhone X will be the first large-scale consumer push for 3D sensing, the technology has been around for years, particularly in industrial applications such as machine vision. 3D sensing is already used in the PC – think Intel’s RealS... » read more