Advanced Packaging Is Real. Now What?


For the past five years, it's been clear that 2.5D, fan-outs and other forms of system-in-package were on the horizon. Exactly when they would arrive no one knew. The most common prediction was that the timing would depend on when one of the big chipmakers decided to go down that route. The theory was that the remainder of the industry would follow, ecosystem issues would be sorted out—partic... » read more

Thinking Outside The Chip


Intel will begin adding 2.5D and 3D packaging into its processors, following the lead set by IBM and AMD in recognizing that new packaging approaches are essential for improving performance and lowering power. This shift won't derail the semiconductor industry's efforts to the reach future process nodes or continually shrink features, but it does add context for other factors that in... » read more

More Choices, Less Certainty


The increasing cost of feature scaling is splintering the chip market, injecting uncertainty into a global supply chain that has been continually fine-tuned for decades. Those with deep enough resources and a clear need for density will likely follow Moore's Law, at least until 7nm. What comes after that will depend on a variety of factors ranging from available lithography—EUV, multi-bea... » read more

Rethinking Differentiation


Differentiation is becoming more difficult, more time-consuming, and in some cases much more expensive for chipmakers. The traditional metrics of faster performance, lower power and less area/cost, which are leftovers from the PC era, no longer are a guarantee of success despite the fact that they are still baseline metrics for many designs. Even new metrics such as ecosystem completeness, w... » read more

2.5D Creeps Into SoC Designs


A decade ago top chipmakers predicted that the next frontier for SoC architectures would be the z axis, adding a third dimension to improve throughput and performance, reduce congestion around memories, and reduce the amount of energy needed to drive signals. The obvious market for this was applications processors for mobile devices, and the first companies to jump on the stacked die bandwag... » read more

The Week In Review: Manufacturing


German laser giant Trumpf is spending more than 70 million euros ($76.9 million) to build a new facility for its laser amplifier technology in EUV lithography applications. Trumpf has nothing to do with the Republican presidential candidate Donald Trump. But rather Trumpf is a German-based supplier of machine tools, lasers and electronics for industrial applications. Meanwhile, Trumpf’s new b... » read more

FinFET Rollout Slower Than Expected


The foundry business is heating up as some new and large players are entering the 16nm/14nm [getkc id="185" kc_name="finFET"] market. But foundry customers are taking longer than expected to migrate to finFETs amid some technical and cost issues. On the foundry front, [getentity id="22846" comment="Intel"] has been the sole player in finFETs for some time. But now, [getentity id="22865" ... » read more

The Week In Review: Design/IoT


Tools Calypto rolled out its third-generation high-level synthesis platform after three years of development, adding granular control over which regions are optimized and the ability to work top-down and bottom-up—basically allowing designers to zoom in and out as needed. In addition, the tool has a 10X increase in capacity and supports SystemC and C++. eSilicon unveiled its online conf... » read more

The Week In Review: Design


IP Synopsys rolled out verification IP for mobile PCIe, including built-in M-PHY, for UVM environments. Cadence introduced MIPI SoundWire controller IP, which allows bi-directional digital communication using low gate count and minimal complexity. Deals ARM and TSMC rolled out a road map for 64-bit ARM-based processors at 10nm. The companies said the early pathfinding work is expected t... » read more

The Week In Review: Design


Tools The Android Open Source Project for ARM’s v8-A architecture is now available as part of the Linaro 14.06 release. The release has been tested on 64-bit multicore processors. Research NXP conducted a secure credit card survey that showed Americans are more likely to pay cash following security breaches at large retail chains, with 69% in favor of secure credit cards to guard against... » read more

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