tag: Hong Kong Science Park

Chip Industry’s Technical Paper Roundup: May 16
By Linda Christensen - 16 May, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=103 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us... » read more

Smelling The Metaverse Via Wearable Wireless Interfaces
By Technical Paper Link - 09 May, 2023 - Comments: 0

A new technical paper titled "Soft, miniaturized, wireless olfactory interface for virtual reality" was published by researchers at  City University of Hong Kong, Hong Kong Science Park, Beihang University, and others. Abstract "Recent advances in virtual reality (VR) technologies accelerate the creation of a flawless 3D virtual world to provide frontier social platform for human. Equall... » read more

Over $7 Billion Raised In Mega-Rounds By 27 Firms
By Jeff Dorsch - 02 Oct, 2019 - Comments: 0

It was also a good month for private equity firms and venture capitalists to raise their own rounds, with the money to be invested in early-stage companies and more mature ventures. A semiconductor company led the month. Nexperia, once the Standard Products business unit of NXP Semiconductors, took in $1.5 billion of senior credit facilities. The money will go toward refinancing debt and par... » read more

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