tag: HPE

Week In Review: Manufacturing, Test
By Linda Christensen - 27 May, 2022 - Comments: 0

Broadcom announced it will acquire cloud computing and virtualization company VMware for about $61 billion in cash and stock, and assume $8 billion in VMware net debt. If all goes as planned, the Broadcom Software Group will rebrand and operate as VMware. “The combined solutions will enable customers, including leaders in all industry verticals, greater choice and flexibility to build, run, m... » read more

Increasing Performance With Data Acceleration
By Martha DeGrasse - 14 Apr, 2022 - Comments: 0

Increasing demand for functions that require a relatively high level of acceleration per unit of data is providing a foothold for in-line accelerator cards, which could mean new opportunities for some vendors and a potential threat for others. For years, either CPUs, or CPUs with FPGA accelerators, met most market needs. But the rapid increase in the volume of data everywhere, coupled with t... » read more

Chiplets Enter The Supercomputer Race
By Mark LaPedus - 17 Mar, 2022 - Comments: 0

Several entities from various nations are racing each other to deliver and deploy chiplet-based exascale supercomputers, a new class of systems that are 1,000x faster than today’s supercomputers. The latest exascale supercomputer CPU and GPU designs mix and match complex dies in advanced packages, adding a new level of flexibility and customization for supercomputers. For years, various na... » read more

Week In Review: Design, Low Power
By Jesse Allen - 09 Jul, 2021 - Comments: 0

Tools Aldec extended its TySOM family of embedded prototyping boards with the introduction of TySOM-M-MPFS250, the first in a planned series to feature a Microchip PolarFire SoC FPGA MPFS250T-FCG1152 and to have dual FMC connectivity. The board contains 16Gb FPGA DDR4 x32, 16Gb MSS DDR4 x36 with ECC, eMMC, SPI Flash memory, 64 Kb EEPROM and a microSD card socket. The PolarFire SoC is a five-st... » read more

Manufacturing Bits: Feb. 23
By Mark LaPedus - 23 Feb, 2021 - Comments: 0

Space crystals Northrop Grumman recently launch its Cygnus spacecraft into space, sending thousands of pounds of critical supplies and experiments to the International Space Station (ISS). The launch, which took place from NASA’s Wallops Flight Facility in Virginia, will deliver a diversity of experiments to the ISS National Laboratory. In one experiment, Redwire’s sixth in-space man... » read more

Realize A More Productive EDA Environment From HPE With AMD
By Ansys - 13 Jan, 2021 - Comments: 0

Few industries are more competitive than modern electronics manufacturing and chip design. Consumers expect devices to be faster, cheaper, and more reliable with each generation. Whether large or small, electronics manufacturers rely on electronic design automation (EDA) to enable these improvements. Click here to access the white paper. » read more

Manufacturing Bits: Dec. 29
By Mark LaPedus - 29 Dec, 2020 - Comments: 1

Chiplet-based exascale computers At the recent IEEE International Electron Devices Meeting (IEDM), CEA-Leti presented a paper on a 3D chiplet technology that enables exascale-level computing systems. The United States and other nations are working on exascale supercomputers. Today’s supercomputers are measured in floating point operations per second. The world’s fastest supercomputers c... » read more

Is Hardware-Assisted Verification Avoidable?
By Brian Bailey - 29 Oct, 2020 - Comments: 1

Emulation is emerging as the tool of choice for complex and large designs, but companies that swap from simulation to emulation increasingly recognize this is not an easy transition. It requires money, time, and effort, and even then not everyone gets it right. Still, there are significant benefits to moving from simulation to emulation, providing these systems can be utilized efficiently en... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 26 Jun, 2020 - Comments: 0

Fast Arm-based supercomputer Japan has taken the lead in the supercomputer race, jumping ahead of the U.S. But China continues to make its presence felt in the arena. Fugaku, an ARM-based supercomputer jointly developed by Japan’s Riken and Fujitsu, is now ranked the world’s fastest supercomputer in the 55th TOP500 list. Fugaku turned in a high performance Linpack (HPL) result of 415.5... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 19 Jun, 2020 - Comments: 0

Security Many IoT devices have some of the 19 bugs known as Ripple20 vulnerabilities. Researchers JSOF discovered the security flaws in library produces by Treck, Inc., which is used in many IoT devices. Edge, cloud, data center Rambus delivered its 112G XSR/USR PHY IP on TSMC 7nm process (N7). The SerDes PHY was designed for chiplets and co-packaged optics (CPO) architectures that are des... » read more

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