Week In Review: Manufacturing, Test

By Mark LaPedus - 02 Jul, 2021 - Comments: 0

Chipmakers and OEMs More delays and product woes at Intel. “INTC disclosed that it is delaying the launch of its next-generation Xeon server processor Sapphire Rapids (10nm) from the end of this year to 1Q22 due to additional validation needed for the chip,” said John Vinh, an analyst at KeyBanc, in a research note. “Production is expected to begin in 1Q22, with the ramp expected to begi... » read more

Confronting Design Challenges With Smaller Thermal Envelopes

By James Bruce - 11 Aug, 2016 - Comments: 0

For design engineers, physics giveth but physics can also taketh away. Consider leading-edge smartphones. Outside the improved performance that each generation gives consumers, the handsets themselves get thinner, sleeker, lighter. The reduction in the Z height is effectively a given with each new generation. In 2010, the HTC Nexus One was 11.5mm thick; this year, the Mate 8 is 7.9mm. Rem... » read more

How Do We Get To Full Throttle In Mobile?

By Brian Fuller - 16 Jun, 2016 - Comments: 0

By Govind Wathan and Brian Fuller With each new generation of mobile device, we look forward to running the latest apps—especially games. (It's amazing how immersive mobile games have become in just a few years). We’re consumers but we’re also engineers, and here we’re faced with a huge challenge. It’s not just the games that get more powerful. A whole new generation of virtual ... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 22 Apr, 2016 - Comments: 0

Chipmakers As reported, Samsung is expanding its efforts in the foundry business, a move that will put the company on a collision course with TSMC and others. Samsung's foundry unit is expanding is logic portfolio and moving into the specialty foundry front. It will also make its advanced packaging technology available, such as 2.5D interposers, to customers. In a blog, Samsung said it plans t... » read more

Tales From The Silk Road

By Jeff Chappell - 18 Dec, 2013 - Comments: 0

Recently I wrote a two-part article on the impact low-cost quad-core and octo-core mobile processors are having on the mobile handset market here in Asia. In it I briefly mentioned that many travelers and expats in this part of the world—this part being Southeast Asia, generally speaking—come here, among myriad other reasons, for the cheap electronics available. What prompted me to inves... » read more

A Brief History Of The Interconnect

By Kurt Shuler - 25 Jul, 2013 - Comments: 0

By Kurt Shuler The high functional integration of system-on-chip designs today is driving the need for new technological approaches in semiconductor design. Anyone who owns a Samsung Galaxy S4, HTC One or comparable smartphone can see the benefits of integrating onto one chip all the computing functions that were traditionally separate, discrete chips on a PC computer motherboard. For next-gen... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer