Startup Funding: February 2023

By Jesse Allen - 08 Mar, 2023 - Comments: 0

The cost of borrowing is going up, but investors continued to pour money into the chip industry in February. Collectively, 132 companies raised more than $4.5 billion last month. One of the big beneficiaries was quantum computing, with nine companies drawing a total of more than $500 million. The bulk of that went to a quantum software and services company spun out of Alphabet, but plenty wa... » read more

Startup Funding: June 2021

By Jesse Allen - 07 Jul, 2021 - Comments: 0

June was the month of mega-rounds for autonomous driving companies, with three pulling in well over $100M. All three are based in China, but their products range from chips to full robotaxi services. Also in the automotive space, an EV battery manufacturer raised over $2B, a solid-state lidar developer drew $300M — and those are just the largest rounds. Plus, new HPC architectures, GAA metrol... » read more

Startup Funding: June 2020

By Jesse Allen - 08 Jul, 2020 - Comments: 0

Two Chinese startups drew big investment as the country aims to become more semiconductor independent as trade restrictions continue. One company deals in wafers, packaging, and IC design, while the other is focused on AI chips. Quantum computing startups didn't see large investments this month, as most are still very young companies, but the number of them grew with a new university spin-out e... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Huatai Securities

Startup Funding: February 2023

Startup Funding: June 2021

Startup Funding: June 2020