The Week In Review: Manufacturing


Chipmakers Samsung Electronics has unveiled its newest memory card globally–the EVO Plus 256GB microSD card. Based on Samsung’s 3D NAND technology, the EVO Plus 256-GB offers the highest capacity for a microSD card in its class. Consumers can now record up to 12 hours of 4K UHD video or 33 hours of Full HD video on their mobile device or action camera without needing to change or replace t... » read more

Silexica: Multicore Software Automation


Multicore programming has a long and troubled history, and it has become much worse as the computing world moves increasingly toward heterogeneous multicore architectures. While it's easy enough to map out the hardware's power/performance characteristics, it is much harder to make the software take advantage of the appropriate cores. Enter Silexa, which began as a research project in 2008 at... » read more

A Formal Transformation


A very important change is underway in functional verification. In the past, this was an esoteric technology and one that was difficult to deploy. It was relegated to tough problems late in the verification cycle, and it was difficult to justify the ROI unless the technology actually did find some problems. But all of that has changed. Formal verification companies started to use the technology... » read more

New Twist On Scalable Electronics?


Snug in their tents at Everest base camp a few years ago, Matt Du Puy and his colleagues marveled at the howling snowstorm outside, until they peeked out and saw snow drifts piling up quickly. They made a quick decision to tug on their boots and seek safer ground. As they did, clutches of other campers emerged and fell in line, bleary-eyed refugees trudging through the darkness. “We got of... » read more

The Week In Review: Manufacturing


Qualcomm recently announced the new Snapdragon 820. The cell-phone chipset is based on Samsung Electronics’ new 14nm LPP (Low-Power Plus) process, the second-generation of the company’s 14nm finFET process technology. What’s next? Qualcomm is developing the Snapdragon 830. “Snapdragon 830 leaks indicate that the chip will sport 8GB of RAM, an enhanced Kryo custom architecture, and fabbe... » read more

Industry Road Map Under Construction


While most engineers think in terms of PPA—the classic power, performance and area tradeoffs—their bosses tend to see the world in terms of risk vs. opportunity. Until 22nm, these two objectives moved forward at roughly the same pace, despite the growing technical challenges of fitting more functionality into an SoC. Much has changed since then, and even more will change over the next f... » read more

Advanced Packaging Is Real. Now What?


For the past five years, it's been clear that 2.5D, fan-outs and other forms of system-in-package were on the horizon. Exactly when they would arrive no one knew. The most common prediction was that the timing would depend on when one of the big chipmakers decided to go down that route. The theory was that the remainder of the industry would follow, ecosystem issues would be sorted out—partic... » read more

Thinking Outside The Chip


Intel will begin adding 2.5D and 3D packaging into its processors, following the lead set by IBM and AMD in recognizing that new packaging approaches are essential for improving performance and lowering power. This shift won't derail the semiconductor industry's efforts to the reach future process nodes or continually shrink features, but it does add context for other factors that in... » read more

Predictions For 2016: Markets


Seventeen companies sent in their predictions for this year with some of them sending predictions from several people. This is in addition to the CEO predictions that were recently published. That is a fine crop of views for the coming year, especially since they know that they will be held accountable for their views and this year, just like the last, they will have to answer for them. We beli... » read more

Reflections On 2015


It is easy to make predictions, but few people can make them with any degree of accuracy. Most of the time, those predictions are forgotten by the end of the year and there is no one to do a tally of who holds more credibility for next year. Not so with Semiconductor Engineering. We like to hold people's feet to the fire, but while the "Pants-On-Fire" meter may be applicable to politicians, we ... » read more

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