tag: Huawei

How Do We Get To Full Throttle In Mobile?
By Brian Fuller - 16 Jun, 2016 - Comments: 0

By Govind Wathan and Brian Fuller With each new generation of mobile device, we look forward to running the latest apps—especially games. (It's amazing how immersive mobile games have become in just a few years). We’re consumers but we’re also engineers, and here we’re faced with a huge challenge. It’s not just the games that get more powerful. A whole new generation of virtual ... » read more

How To Build Systems In Package
By Ed Sperling - 15 Jun, 2016 - Comments: 0

The semiconductor industry is racing to define a series of road maps for semiconductors to succeed the one created by the ITRS, which will no longer be updated, including a brand new one focused on heterogeneous integration. The latest entry will establish technology targets for integration of heterogeneous multi-die devices and systems. It has the support of IEEE's Components, Packaging and... » read more

Formal Confusion
By Brian Bailey - 07 Jun, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss the right and wrong ways to apply formal verification technology with Normando Montecillo, associate technical director at [getentity id="22649" comment="Broadcom"]; Ashish Darbari, principal engineer at [getentity id="22709" e_name="Imagination Technologies"]; Roger Sabbagh, principal engineer at Huawei; and Stuart Hoad, lead engineer at PMC Sierra... » read more

Formal Confusion
By Brian Bailey - 26 May, 2016 - Comments: 0

Formal verification has come a long way in the past five years. Tool developers changed direction and started to create self-contained apps which have led to a rapid proliferation of the technology. But formal is a diverse set of tools that can solve a variety of problems in the verification space and this has created a different kind of confusion within the industry. To find out how the indust... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 13 May, 2016 - Comments: 0

Chipmakers Samsung Electronics has unveiled its newest memory card globally–the EVO Plus 256GB microSD card. Based on Samsung’s 3D NAND technology, the EVO Plus 256-GB offers the highest capacity for a microSD card in its class. Consumers can now record up to 12 hours of 4K UHD video or 33 hours of Full HD video on their mobile device or action camera without needing to change or replace t... » read more

Silexica: Multicore Software Automation
By Ed Sperling - 04 Apr, 2016 - Comments: 0

Multicore programming has a long and troubled history, and it has become much worse as the computing world moves increasingly toward heterogeneous multicore architectures. While it's easy enough to map out the hardware's power/performance characteristics, it is much harder to make the software take advantage of the appropriate cores. Enter Silexa, which began as a research project in 2008 at... » read more

A Formal Transformation
By Brian Bailey - 24 Mar, 2016 - Comments: 0

A very important change is underway in functional verification. In the past, this was an esoteric technology and one that was difficult to deploy. It was relegated to tough problems late in the verification cycle, and it was difficult to justify the ROI unless the technology actually did find some problems. But all of that has changed. Formal verification companies started to use the technology... » read more

New Twist On Scalable Electronics?
By Brian Fuller - 14 Mar, 2016 - Comments: 0

Snug in their tents at Everest base camp a few years ago, Matt Du Puy and his colleagues marveled at the howling snowstorm outside, until they peeked out and saw snow drifts piling up quickly. They made a quick decision to tug on their boots and seek safer ground. As they did, clutches of other campers emerged and fell in line, bleary-eyed refugees trudging through the darkness. “We got of... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 29 Jan, 2016 - Comments: 0

Qualcomm recently announced the new Snapdragon 820. The cell-phone chipset is based on Samsung Electronics’ new 14nm LPP (Low-Power Plus) process, the second-generation of the company’s 14nm finFET process technology. What’s next? Qualcomm is developing the Snapdragon 830. “Snapdragon 830 leaks indicate that the chip will sport 8GB of RAM, an enhanced Kryo custom architecture, and fabbe... » read more

Industry Road Map Under Construction
By Ed Sperling - 21 Jan, 2016 - Comments: 0

While most engineers think in terms of PPA—the classic power, performance and area tradeoffs—their bosses tend to see the world in terms of risk vs. opportunity. Until 22nm, these two objectives moved forward at roughly the same pace, despite the growing technical challenges of fitting more functionality into an SoC. Much has changed since then, and even more will change over the next f... » read more

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