tag: Huawei

A Formal Transformation
By Brian Bailey - 24 Mar, 2016 - Comments: 0

A very important change is underway in functional verification. In the past, this was an esoteric technology and one that was difficult to deploy. It was relegated to tough problems late in the verification cycle, and it was difficult to justify the ROI unless the technology actually did find some problems. But all of that has changed. Formal verification companies started to use the technology... » read more

New Twist On Scalable Electronics?
By Brian Fuller - 14 Mar, 2016 - Comments: 0

Snug in their tents at Everest base camp a few years ago, Matt Du Puy and his colleagues marveled at the howling snowstorm outside, until they peeked out and saw snow drifts piling up quickly. They made a quick decision to tug on their boots and seek safer ground. As they did, clutches of other campers emerged and fell in line, bleary-eyed refugees trudging through the darkness. “We got of... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 29 Jan, 2016 - Comments: 0

Qualcomm recently announced the new Snapdragon 820. The cell-phone chipset is based on Samsung Electronics’ new 14nm LPP (Low-Power Plus) process, the second-generation of the company’s 14nm finFET process technology. What’s next? Qualcomm is developing the Snapdragon 830. “Snapdragon 830 leaks indicate that the chip will sport 8GB of RAM, an enhanced Kryo custom architecture, and fabbe... » read more

Industry Road Map Under Construction
By Ed Sperling - 21 Jan, 2016 - Comments: 0

While most engineers think in terms of PPA—the classic power, performance and area tradeoffs—their bosses tend to see the world in terms of risk vs. opportunity. Until 22nm, these two objectives moved forward at roughly the same pace, despite the growing technical challenges of fitting more functionality into an SoC. Much has changed since then, and even more will change over the next f... » read more

Advanced Packaging Is Real. Now What?
By Ed Sperling - 14 Jan, 2016 - Comments: 0

For the past five years, it's been clear that 2.5D, fan-outs and other forms of system-in-package were on the horizon. Exactly when they would arrive no one knew. The most common prediction was that the timing would depend on when one of the big chipmakers decided to go down that route. The theory was that the remainder of the industry would follow, ecosystem issues would be sorted out—partic... » read more

Thinking Outside The Chip
By Ed Sperling - 14 Jan, 2016 - Comments: 0

Intel will begin adding 2.5D and 3D packaging into its processors, following the lead set by IBM and AMD in recognizing that new packaging approaches are essential for improving performance and lowering power. This shift won't derail the semiconductor industry's efforts to the reach future process nodes or continually shrink features, but it does add context for other factors that in... » read more

Predictions For 2016: Markets
By Brian Bailey - 14 Jan, 2016 - Comments: 0

Seventeen companies sent in their predictions for this year with some of them sending predictions from several people. This is in addition to the CEO predictions that were recently published. That is a fine crop of views for the coming year, especially since they know that they will be held accountable for their views and this year, just like the last, they will have to answer for them. We beli... » read more

Reflections On 2015
By Brian Bailey - 10 Dec, 2015 - Comments: 0

It is easy to make predictions, but few people can make them with any degree of accuracy. Most of the time, those predictions are forgotten by the end of the year and there is no one to do a tally of who holds more credibility for next year. Not so with Semiconductor Engineering. We like to hold people's feet to the fire, but while the "Pants-On-Fire" meter may be applicable to politicians, we ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 27 Nov, 2015 - Comments: 0

At one time, China’s Xiaomi was a high-flying smartphone vendor. The privately-held company had a market capitalization of $45 billion. But the bottom has fallen out of the company amid share losses. “By early 2015, it was clear that problems were emerging as growth ground to a halt and nothing that Xiaomi has done since has been able to re-start it. Xiaomi has ground to halt because there ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 06 Nov, 2015 - Comments: 0

China is investing billions of dollars in the IC industry and equipment sectors. The nation is also in the midst of an acquisition and an investment spree, especially in IC packaging. For example, Jiangsu Changjiang Electronics Technology (JCET), a Chinese OSAT, shook up the landscape by recently announcing a deal to acquire STATS ChipPAC for $780 million. The deal was completed in August of 20... » read more

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