tag: Huawei

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 27 May, 2022 - Comments: 0

Automotive, mobility Cadence is now an official technology partner of the McLaren Formula 1 Team. The team will use Cadence’s Fidelity CFD Software to look at the computational fluid dynamics (CFD) of the airflow around the race cars and predict how a car design will affect the airflow. Infineon uncorked its XENSIV 60 GHz automotive radar sensor for in-cabin monitoring systems. One use ca... » read more

Speeding Up Scan-Based Volume Diagnosis
By Bryon Moyer - 07 Dec, 2021 - Comments: 0

In the critical process known as new-product bring-up, it’s a race to get new products to yield as quickly as possible. But the interplay between increasingly complex aspects of designs and process makes it difficult to find root causes of yield issues so they can be fixed quickly. Advanced processes have very high defectivity, and learning must be fast and effective. While progress has be... » read more

Adaptive NN-Based Root Cause Analysis in Volume Diagnosis for Yield Improvement
By Technical Paper Link - 02 Dec, 2021 - Comments: 1

Abstract "Root Cause Analysis (RCA) is a critical technology for yield improvement in integrated circuit manufacture. Traditional RCA prefers unsupervised algorithms such as Expectation Maximization based on Bayesian models. However, these methods are severely limited by the weak predictive capability of statistical models and can’t effectively transfer the yield learning experience from old... » read more

China Accelerates Foundry, Power Semi Efforts
By Mark LaPedus - 22 Nov, 2021 - Comments: 4

China has unveiled several initiatives to advance its domestic semiconductor industry, including a new and massive fab expansion campaign in the foundry, gallium-nitride (GaN), and silicon carbide (SiC) markets. The nation is making a big push into what it calls “third-generation semiconductors,” which is a misnomer. The term actually refers to two existing and common power semiconductor... » read more

System-In-Package Thrives In The Shadows
By Mark LaPedus - 16 Sep, 2021 - Comments: 0

IC packaging continues to play a big role in the development of new electronic products, particularly with system-in-package (SiP), a successful approach that continues to gain momentum — but mostly under the radar because it adds a competitive edge. With a SiP, several chips and other components are integrated into a package, enabling it to function as an electronic system or sub-system. ... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 10 Sep, 2021 - Comments: 0

Automotive Intel’s Mobileye and Sixt SE said they are collaborating on an autonomous ride-hailing services in Munich in 2022. Mobileye will own the robotaxi fleet. Mobileye also recently unveiled its electric autonomous vehicle (AV), which it will use in ridehailing in Munich and Tel Aviv.. To increase the supply of automotive chips, Intel said it will build new chip manufacturing facilit... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 30 Jul, 2021 - Comments: 0

Chipmakers Intel has outlined its new process technology roadmap with plans to regain the leadership position in the market. As part of the move, Intel has changed the way it designates the nodes, revealed its new gate-all-around (GAA) transistor, and disclosed a customer for the GAA technology--Qualcomm. And not to be outdone, Intel has broadened its packaging portfolio. Intel is changing ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 30 Apr, 2021 - Comments: 0

Chipmakers and OEMs Intel wants $9.7 billion in subsidies for use in building a leading-edge fab in Europe, according to a report from Reuters. As reported, in March, Intel re-entered the foundry business, positioning itself against Samsung and TSMC at the leading edge, and against a multitude of foundries working at older nodes. Eighteen members of the European Union recently launched an ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 29 Jan, 2021 - Comments: 0

Packaging and test Intel has invested an additional $475 million in its chip assembly and test manufacturing facility in the Saigon Hi-Tech Park (SHTP) in Vietnam. This takes Intel’s total investment in the Vietnam facility to $1.5 billion. The site assembles and tests Intel’s 5G products and processors. TSMC recently announced a huge increase in capital spending for 2021. A large perce... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 22 Jan, 2021 - Comments: 0

Chipmakers Intel posted its quarterly results. But the big question is whether the chip giant will outsource more of its production to the foundries. As reported, Intel has fallen behind TSMC and Samsung in process technology. And Intel may need to outsource some of its chip production to stay ahead. All of this rests on Pat Gelsinger, the new CEO at Intel. Gelsinger will be taking over for... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy