Enabling Advanced Devices With Atomic Layer Processes

By Katherine Derbyshire - 18 Apr, 2024 - Comments: 2

Atomic layer deposition (ALD) used to be considered too slow to be of practical use in semiconductor manufacturing, but it has emerged as a critical tool for both transistor and interconnect fabrication at the most advanced nodes. ALD can be speeded up somewhat, but the real shift is the rising value of precise composition and thickness control at the most advanced nodes, which makes the ext... » read more

Research Bits: Apr. 2

By Jesse Allen - 02 Apr, 2024 - Comments: 0

Stretchy, sensitive circuits Researchers from Stanford University developed skin-like, stretchable integrated circuits capable of driving a micro-LED screen with a refresh rate of 60 Hz and detecting a braille array that is more sensitive than human fingertips. The stretchable transistors are made from semiconducting carbon nanotubes sandwiched between soft elastic electronic materials. The... » read more

Research Bits: May 17

By Jesse Allen - 17 May, 2022 - Comments: 0

Magnetic storage structures Researchers from The Ohio State University and Universidad Nacional Autonoma de Mexico investigated a new material that could potentially increase the capacity of magnetic storage devices. They identified manganese germanide, an unusual magnetic material in which the magnetism follows helices, similar to the structure of DNA. The structure gives rise to a number ... » read more

2D materials–based homogeneous transistor-memory architecture for neuromorphic hardware

By Technical Paper Link - 21 Aug, 2021 - Comments: 0

Abstract "In neuromorphic hardware, peripheral circuits and memories based on heterogeneous devices are generally physically separated. Thus exploring homogeneous devices for these components is an important issue for improving module integration and resistance matching. Inspired by ferroelectric proximity effect on two-dimensional materials, we present a tungsten diselenide-on-LiNbO3 cascaded... » read more

Power/Performance Bits: March 30

By Jesse Allen - 30 Mar, 2021 - Comments: 0

Harvesting body heat Researchers at University of Colorado Boulder, Harbin Institute of Technology, Southeast University, and Huazhong University of Science and Technology designed a stretchy thermoelectric generator that can be worn against the skin to power small wearable electronics using body heat. The stretchy material polyimine is used as the base of the device. A series of thin therm... » read more

Power/Performance Bits: June 18

By Jesse Allen - 18 Jun, 2019 - Comments: 0

Multi-value logic transistor Researchers at the University of Texas at Dallas, Hanyang University, Gwangju Institute of Science and Technology, Yonsei University, Kookmin University, and Ulsan National Institute of Science and Technology developed and fabricated a transistor capable of storing intermediate values between 0 and 1. Such a multi-value logic transistor would allow more operations ... » read more

System Bits: June 4

By Jeff Dorsch - 04 Jun, 2019 - Comments: 0

Thin films for quantum computing Researchers at Los Alamos National Laboratory report their development of two-dimensional tungsten/selenium thin films that can control the emission of single photons, potentially useful in quantum technologies. “Efficiently controlling certain thin-film materials so they emit single photons at precise locations—what’s known as deterministic quantum em... » read more

Power/Performance Bits: May 21

By Jesse Allen - 21 May, 2019 - Comments: 0

More speculative vulnerabilities Security researchers at the Graz University of Technology, KU Leuven, Cyberus Technology, and Worcester Polytechnic Institute point to two new speculative execution vulnerabilities related to Meltdown and Spectre. The first, which they dubbed ZombieLoad, uses a similar approach to Meltdown. After preparing tasks in parallel, the processor needs to discard th... » read more

Power/Performance Bits: April 23

By Jesse Allen - 23 Apr, 2019 - Comments: 0

Tiny spectrometer Engineers at the University of Wisconsin-Madison, Sandia National Laboratories, and Huazhong University of Science and Technology developed a miniature spectrometer small enough to integrate with the camera on a typical cellphone without sacrificing accuracy. This miniature sensor is CMOS compatible. "This is a compact, single-shot spectrometer that offers high resolution ... » read more

Power/Performance Bits: Jan. 29

By Jesse Allen - 29 Jan, 2019 - Comments: 0

Neural nets struggle with shape Cognitive psychologists at the University of California Los Angeles investigated how deep convolutional neural networks identify objects and found a big difference between the way these networks and humans perceive objects. In the first of a series of experiments, the researchers showed color images of animals and objects that had been altered to have a diffe... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?