tag: hybrid bonding

Thermal Analysis Of 3D Stacking And BEOL Technologies With Functional Partitioning Of Many-Core RISC-V SoC
By Cadence - 26 Feb, 2025 - Comments: 0

Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization (STCO) promises to mitigate technology scaling bottlenecks with system architecture tuning based on emerging technology offerings, including 3D technology. This white paper analyzes the impact of mat... » read more

Low-Temperature Solid-Liquid Interdiffusion Bonding For High-Density Interconnect Applications
By Technical Paper Link - 19 Feb, 2025 - Comments: 0

A new technical paper titled "Facilitating Small-Pitch Interconnects with Low-Temperature Solid-Liquid Interdiffusion Bonding" was published by researchers at Aalto University in Finland. Abstract "The trend for 3D heterogeneous integration drives the need for a low-temperature bonding process for high-density interconnects (HDI). The Cu-Sn-In based solid-liquid interdiffusion (SLID) is a p... » read more

Chiplets: Where Are We Today?
By Barry Pangrle - 05 Feb, 2025 - Comments: 1

The 3rd annual Chiplet Summit was held in Santa Clara from January 21st to 23rd at the Convention Center. The conference continues to grow from its 1st year when it was held at the San Jose Doubletree Hotel (almost exactly 2 years ago). During his Chairman’s Welcome presentation, Chuck Sobey mentioned that there were 41 exhibitors at this year’s conference. Chuck was also the moderator f... » read more

Optimization of Oxygen Plasma Conditions for Cu-Cu Bonding
By Technical Paper Link - 04 Feb, 2025 - Comments: 0

A new technical paper titled "Understanding and Optimizing Oxygen Plasma Treatment for Enhanced Cu-Cu Bonding Application" was published by researchers at Seoul National University of Science and Technology. Abstract "This study investigates the optimization of O2 plasma treatment conditions to enhance Cu-Cu bonding. The O2 plasma treatment conditions were optimized using Design of Experime... » read more

Electrifying Everything: Power Moves Toward ICs
By Gregory Haley - 23 Jan, 2025 - Comments: 0

As electronic systems grow increasingly complex and energy-intensive, traditional power management methods — centered on centralized systems and external components — are proving inadequate. The next wave of innovation is to bring power control closer to the action — directly on the chip or into a heterogeneous package. This change is driven by a relentless pursuit of efficiency, scala... » read more

Upcoming Challenges And Changes In Semiconductor Materials
By Laura Peters And Ed Sperling - 23 Jan, 2025 - Comments: 0

Semiconductor Engineering sat down with Dan Brewer and Srikanth Kommu, co-CEOs at Brewer Science, to talk about current and future changes in materials used in semiconductor manufacturing and adjacent markets. What follows are excerpts of that conversation. SE: What was behind the decision to have co-CEOs instead of just one? Brewer: We see a lot of value to having multiple perspectives b... » read more

Ammonia Plasma Surface Treatment for Improved Cu–Cu Bonding Reliability
By Technical Paper Link - 27 Dec, 2024 - Comments: 0

A new technical paper titled "Ammonia Plasma Surface Treatment for Enhanced Cu–Cu Bonding Reliability for Advanced Packaging Interconnection" was published by researchers at Myongji University. Abstract "With the emergence of 3D stacked semiconductor products, such as high-bandwidth memory, bonding-interface reliability cannot be overemphasized. The condition of the surface interface befo... » read more

Advanced Packaging Drives Test And Metrology Innovations
By Gregory Haley - 12 Nov, 2024 - Comments: 1

Advanced packaging has become a focal point for innovation as the semiconductor industry continues to push for increased transistor density and better performance. But the pace of change is accelerating, making it harder for the entire ecosystem to keep up with those changes. In the past, major developments were roughly on an 18-month to 2-year cadence. Today, this is happening every few mon... » read more

Hybrid Bonding Makes Strides Toward Manufacturability
By Laura Peters - 28 Oct, 2024 - Comments: 0

Hybrid bonding is gaining traction in advanced packaging because it offers the shortest vertical connection between dies of similar or different functionalities, as well as better thermal, electrical and reliability results. Advantages include interconnect scaling to submicron pitches, high bandwidth, enhanced power efficiency, and better scaling relative to solder ball connections. But whil... » read more

Multi-Tier Die Stacking Enables Efficient Manufacturing
By Jessica Albright - 24 Oct, 2024 - Comments: 0

Advanced packaging is currently facing a critical challenge to increase manufacturing efficiency without sacrificing device performance. Vertical integration techniques, such as multi-tier die stacking and hybrid bonding, enable increased integration density, therefore improving yield of high-quality devices. However, these highly precise processes require significant attention to defectivity... » read more

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