Foundry Landscape Changes In 3D

By Mark LaPedus - 13 Dec, 2012 - Comments: 0

By Mark LaPedus Over the last year, leading-edge silicon foundries announced their new and respective strategies in the emerging 2.5D/3D chip arena. The ink is barely dry and now the foundry landscape is changing. One new vendor, Tezzaron Semiconductor, is entering the market. The 3D DRAM supplier plans to provide select 2.5D/3D foundry services within its recently acquired fab in Austin, T... » read more

Looking Upstream

By Ed Sperling - 28 Sep, 2012 - Comments: 0

The majority of attention in energy efficiency is focused on consumer pain—how long a device can last between charges—but the real quantum leaps are happening further upstream these days. This is good news for a couple of reasons. First, it provides lots of opportunity for semiconductors in a market where pricing is much more elastic. Companies are willing to pay for energy savings, whic... » read more

Thanks For The Memories

By Ed Sperling - 27 Sep, 2012 - Comments: 0

By Ed Sperling The amount of real estate in a design now devoted to memories—SRAM on chip, DRAM off chip, and a few other more exotic options showing up occasionally—is a testament to the amount of data that needs to be utilized quickly in both mobile and fixed devices. Memory is almost singlehandedly responsible for the routing congestion now plaguing complex SoCs. It is one of the mai... » read more

Quiet, Steady And Sometimes Unexpected Advances For SOI

By Ed Sperling - 20 Sep, 2012 - Comments: 0

By Ed Sperling After years of talking about equivalent pricing, technical advantages and consistent processes, silicon on insulator finally appears to be making significant inroads—but not necessarily in ways, places, or even at process nodes where it initially was predicted to gain ground. What’s driving at least some of this change is the semiconductor industry’s progression toward ... » read more

Content And Gaming Drive Design

By Ed Sperling - 17 Nov, 2011 - Comments: 0

By Pallab Chatterjee This year’s IEDM conference will feature a non-device topic for the luncheon keynote from Masaaki Tsuruta, CTO of Sony on Interactive Gaming. The takeaway: Even in the heavy R&D and physics-centric world of devices, building for the end application has now become one of the top priorities in driving specifications. Traditional compute systems were based on batch-... » read more

Bigger Pipes, New Priorities

By Ed Sperling - 28 Jul, 2011 - Comments: 0

By Ann Steffora Mutschler From the impact of stacking on memory subsystems to advances in computing architecture, Micron Technology is at the forefront in the memory industry. System-Level Design sat down to discuss challenges, as well as some possible solutions, that plague memory subsystem architects with Scott Graham, general manager for Micron’s Hybrid Memory Cube (HMC) and Joe Jeddeloh,... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer