Week in Review: IoT, Security, Auto

By Jeff Dorsch - 24 May, 2019 - Comments: 0

Internet of Things The Wing unit of Alphabet this summer will begin making drone deliveries in the Vuosarri district of Helsinki, Finland. The unmanned aerial vehicles will bear food and other items from Herkku Food, a gourmet market, and the Café Monami restaurant. The drones will bear deliveries of up to 3.3 pounds over distances of up to 6.2 miles. Comcast is reportedly developing an in... » read more

GF Closes On IBM Chip Business Purchase

By Ann Mutschler - 01 Jul, 2015 - Comments: 0

By Ann Steffora Mutschler, Ed Sperling and Mark LaPedus GlobalFoundries completed its acquisition of IBM's Microelectronics Group today, creating a behemoth that is expected to extend well beyond the combined footprint of the existing companies. To begin with, GlobalFoundries will get two additional fabs, one of which makes RF SOI chips. But while IBM was hesitant to expand that business ... » read more

An Inside Look At The GlobalFoundries-IBM Deal

By Ed Sperling - 20 Nov, 2014 - Comments: 3

GlobalFoundries' proposed acquisition of IBM Microelectronics is the kind of deal that will have business schools talking for many years to come—a gargantuan combination of expertise and technology, built on the back of high-profile business successes and failures, long-running legal struggles and global politics—with far-reaching implications for all parts of the semiconductor supply chain... » read more

IBM Unloads Chip Biz To GF

By The SE Staff - 20 Oct, 2014 - Comments: 0

By Ed Sperling & Mark LaPedus After months of on-again, off-again negotiations, [getentity id="22306" comment="IBM"] agreed to hand over its Microelectronics unit to [getentity id="22819" comment="GlobalFoundries"] for $1.5 billion—meaning IBM will actually pay GlobalFoundries that amount to get rid of what has become an albatross for Big Blue. To really sweeten the deal, GlobalFoundr... » read more

Knowledge Centers
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Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: IBM Microelectronics

Week in Review: IoT, Security, Auto

GF Closes On IBM Chip Business Purchase

An Inside Look At The GlobalFoundries-IBM Deal

IBM Unloads Chip Biz To GF

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