tag: IBM

System Bits: March 22
By Ann Mutschler - 22 Mar, 2016 - Comments: 0

How nanocrystal structures self assemble Researchers at MIT and the Cornell High Energy Synchrotron Source (CHESS) have discovered some of the secrets to a long-hidden magic trick behind the self-assembly of nanocrystal structures, the understanding of which could be used to create more vivid display screens and optical sensory devices. The transformation of simple colloidal particles — b... » read more

Timing Is Everything
By Ed Sperling - 17 Mar, 2016 - Comments: 0

It's easy to look back on companies or products that missed the market because they were too early. Remember the Eo? The brick-like personal digital assistant that AT&T introduced in 1993 had an antenna that hinted at 4G connectivity. Unfortunately, there was no 4G available at the time, so it was just an extra wire. (Check out the video of the tablet version here.) The EO 440 Personal... » read more

Insider’s Guide To Photomasks
By Mark LaPedus - 17 Mar, 2016 - Comments: 1

Semiconductor Engineering sat down to talk about photomasks and lithography with Franklin Kalk, executive vice president of technology at Toppan Photomasks, a merchant photomask supplier. What follows are excerpts of that conversation. SE: What’s hot in mask technology these days? Kalk: It’s everything from the bleeding-edge like EUV to much more mature manufacturing. On the mature si... » read more

Manufacturing Bits: March 8
By Mark LaPedus - 08 Mar, 2016 - Comments: 1

5G mmWave consortium Amid a slowdown in the cell phone business, the market is heating up for perhaps the next big thing in wireless—5th generation mobile networks or 5G. Carriers, chipmakers and telecom equipment vendors are all rushing to get a piece of the action in 5G, which is the follow-on to the current wireless standard known as 4G or long-term evolution (LTE). Radio-frequency (RF... » read more

Racing To Design Chips Faster
By Ed Sperling - 25 Feb, 2016 - Comments: 6

A shift is underway to develop chips for more narrowly defined market segments, and in much smaller production runs. Rather than focusing on shrinking features and reducing cost per transistor by the billions of units, the emphasis behind this shift is less about scale and much more about optimization for specific markets and delivering those solutions more quickly. As automotive, consumer e... » read more

Internet of FD-SOI Things?
By Katherine Derbyshire - 18 Feb, 2016 - Comments: 0

Are fully-depleted silicon-on-insulator (FD-SOI) wafers having a moment? Certainly SOI wafers are not new. Soitec’s SmartCut layer transfer technology was patented in 1994, and wafers with implanted oxide layers were available before that. Still, adoption of SOI wafers has been limited. Though they offer improved device isolation and reduced parasitics, the increased wafer cost has been an ob... » read more

Why Power Modeling Is So Difficult
By Ed Sperling - 15 Feb, 2016 - Comments: 2

Power modeling has been talked about for years and promoted by EDA vendors and chipmakers as an increasingly important tool for advanced designs. But unlike hardware and software modeling, which have been proven to speed time to market for multiple generations of silicon, power modeling has some unique problems that are more difficult to solve. Despite continued development in this field, po... » read more

Will 3D-IC Work?
By Ed Sperling - 11 Feb, 2016 - Comments: 3

Advanced packaging is becoming real on every level, from fan-outs to advanced fan-outs, 2.5D, and 3D-ICs for memory. But just how far 3D and monolithic 3D will go isn't clear at this point. The reason is almost entirely due to heat. In a speech at SEMI's Integrated Strategy Symposium in January, Babek Sabi, Intel corporate VP and director of assembly and test technology development, warned t... » read more

Enablement For A Decade Of Innovation
By Frank Schirrmeister - 28 Jan, 2016 - Comments: 0

As I do every January, I am looking back 5, 10, and 15 years to see what predictions did and did not turn out to be right, and how that relates to design technologies enabling those developments. Looking back five years reveals just how key system-development technologies were for what IEEE dubbed the “Top 11 Technologies of the Decade”. Looking back 10 years shows how they enabled communic... » read more

Inside Neuromorphic Computing
By Mark LaPedus - 25 Jan, 2016 - Comments: 2

Semiconductor Engineering sat down to talk about neuromorphic technology with Guy Paillet, chief executive of General Vision. The fabless IC design house is a pioneer and supplier of neuromorphic chips. What follows are excerpts of that conversation. SE: In 1993, you invented and co-patented a neural networking chip with IBM. Then, you joined General Vision in 1999. Briefly tell us about Gen... » read more

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