tag: IBM

Advanced Packaging Is Real. Now What?
By Ed Sperling - 14 Jan, 2016 - Comments: 0

For the past five years, it's been clear that 2.5D, fan-outs and other forms of system-in-package were on the horizon. Exactly when they would arrive no one knew. The most common prediction was that the timing would depend on when one of the big chipmakers decided to go down that route. The theory was that the remainder of the industry would follow, ecosystem issues would be sorted out—partic... » read more

Thinking Outside The Chip
By Ed Sperling - 14 Jan, 2016 - Comments: 0

Intel will begin adding 2.5D and 3D packaging into its processors, following the lead set by IBM and AMD in recognizing that new packaging approaches are essential for improving performance and lowering power. This shift won't derail the semiconductor industry's efforts to the reach future process nodes or continually shrink features, but it does add context for other factors that in... » read more

Shifting Performance Bottlenecks Driving Change In Chip And System Architectures
By Steven Woo - 14 Jan, 2016 - Comments: 0

The rise of personal computing in the 1980s — along with graphical user interfaces (GUIs) and applications ranging from office apps to databases — drove the demand for faster chips capable of removing processing bottlenecks and delivering a more responsive end-user experience. Indeed, the semiconductor industry has certainly come quite a long way since IBM launched its PC way back in 1981. ... » read more

System Bits: Dec. 29
By Ann Mutschler - 29 Dec, 2015 - Comments: 0

Optoelectronics built using existing manufacturing Using only processes found in existing microchip fabrication facilities, researchers at MIT, the University of California at Berkeley, and the University of Colorado have produced a working optoelectronic microprocessor that computes electronically but uses light to move information. The researchers reminded that optical communications prom... » read more

Foundries Face Challenges in 2016
By Mark LaPedus - 17 Dec, 2015 - Comments: 2

Generally, 2015 has been a challenging year in the foundry business. For one thing, the foundry industry will register modest growth in 2015. In addition, the foundry customer base is consolidating. And on the leading edge, foundries took longer than expected to ramp up their 16nm/14nm finFET processes. So, after an eventful year in 2015, what’s in store for the foundry business in 2016? I... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 04 Dec, 2015 - Comments: 2

For years, China has been trying to get a domestic IC equipment industry off the ground, but it has experienced modest success in the arena. Now, China may take a new strategy—acquire fab tool makers. In what could be a sign of things to come, China’s Beijing E-Town Dragon Semiconductor Industry Investment Center has entered into a definitive agreement to acquire U.S.-based fab tool vendor ... » read more

The Challenge Of Fitting In
By Ann Mutschler - 30 Nov, 2015 - Comments: 0

Connections between players in the semiconductor industry are becoming critical for survival. Whether the focus is a connected car, home automation, health care or the energy grid, each company in each of those markets relies on others to build useful products. There are several forces at work here. One is an emphasis on connecting everything, regardless of whether it is inside a single vert... » read more

Top Articles For 2015 In SLD And LPHP
By Brian Bailey - 24 Nov, 2015 - Comments: 0

Knowing your readership is the first step in being able to serve them better, and judging by the traffic increases this year, we must be doing quite a few things right. We have now completed our second full year and the first full year for the Knowledge Center (KC). We are pleased with the way in which the two are playing together but there is still a lot of work ahead of and many holes to fill... » read more

The Silicon Foundry Market Is Alive And Well
By Rich Wawrzyniak - 19 Nov, 2015 - Comments: 0

I attended the ARM TechCon conference in Santa Clara last week and met with the GlobalFoundries team to discuss their new 14nm finFET technology. GlobalFoundries’ 14LPP technology offering was qualified in the third quarter of 2015 and is on track for volume production in 2016. FX-14 design kits are available to customers now.  This announcement was the culmination of an extensive body of... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 13 Nov, 2015 - Comments: 0

IC Insights released its preliminary top IC rankings in terms of sales for 2015. In the rankings, Intel remains in first place in terms of chip sales in 2015, followed by Samsung and TSMC. GlobalFoundries and UMC also moved up in the rankings. Beyond that, the market is in flux. “The pending mergers of Avago and Broadcom and NXP and Freescale will have a significant impact on future top-20 ra... » read more

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