tag: IBM

Different Tradeoffs
By Ed Sperling - 23 Feb, 2012 - Comments: 0

By Ed Sperling The push to “smaller, faster and cheaper” hasn’t changed since ICs were first introduced, but the context for those requirements is beginning to shift—with enormous consequences. What was once done on multiple chips continue to migrate to a single chip or package because of cost, but in some cases the decisions about goes where go well beyond an individual device to i... » read more

Different Tradeoffs
By Ed Sperling - 23 Feb, 2012 - Comments: 0

By Ed Sperling The push to “smaller, faster and cheaper” hasn’t changed since ICs were first introduced, but the context for those requirements is beginning to shift—with enormous consequences. What was once done on multiple chips continue to migrate to a single chip or package because of cost, but in some cases the decisions about goes where go well beyond an individual device to i... » read more

Reverse Engineering
By Ed Sperling - 26 Jan, 2012 - Comments: 0

By Ed Sperling Fabs and foundries frequently have been the savior of flawed designs, fixing problems such as power and performance, identifying design issues and often developing solutions to those problems. Over the next couple of process nodes, and in stacked die that will span multiple processes, there will be far fewer saves coming from the back end. Double and triple patterning, stress... » read more

Ambient Computing: Interdependencies Rule
By Ed Sperling - 26 Jan, 2012 - Comments: 0

By Ann Steffora Mutschler Ambient computing: Just the concept conjures up images of a Star Trek-like ‘Computer’ that is ever at the ready, awaiting a query at any moment, and which can discern as well as perform significant tasks. While Apple’s Siri gets there partway, it is significant because the concepts that make the technology possible behind the scenes draw upon a multidisciplinary... » read more

3D DRAM Makers Inch Closer To Production
By Ed Sperling - 01 Dec, 2011 - Comments: 0

By Mark LaPedus For some time, DRAM makers have been developing 3D memory chips, but commercial products still are not due out for some time because of technical and cost issues. But the advent of the 3D DRAM era could be near the turning point, as two memory rivals have separately moved to bring their respective technologies closer to production. In one move, Micron Technology Inc. has di... » read more

SOI Conference Shows SOI Driving Key Roadmaps
By Various Writers - 21 Oct, 2011 - Comments: 0

By Adele Hars The 2011 IEEE SOI Conference, held in Tempe, AZ last week was not one to miss…but I did. Happily, I got the papers right away, along with observations shared by some of the folks who did get there. Highlights include excellent and insightful papers from ST, ARM, IBM, Intel, Leti, Peregrine and GlobalFoundries, plus many more that indicate SOI-based technologies are at th... » read more

Collaboration Grows
By Ed Sperling - 20 Oct, 2011 - Comments: 0

By Ed Sperling A series of recent announcements by the Big Three EDA vendors and their well-known partners from across the disaggregated SoC ecosystem is lending new credence to the impact of collaboration. While IDMs such as Apple, Intel, Samsung and IBM continue to blaze their own trail, developing in-house tools, methodologies, processes and chips, fabless companies working with foundrie... » read more

FD-SOI Foundations Ready, Say Semi Execs
By Various Writers - 09 Sep, 2011 - Comments: 0

By Adele Hars SOI (especially fully depleted “FD-SOI”) was a hot topic in the video and audio interviews that Debra Vogler of SST released recently. Here are brief summaries of the most important SOI-related interviews – with top brass from Leti, Soitec, KT, EVG and Qcept –  that she made at Semicon West ’11. (If you need a quick backgrounder on FD-SOI basics, see this exp... » read more

Low Power Drives New Architectures
By Ed Sperling - 08 Sep, 2011 - Comments: 0

By Pallab Chatterjee Power became the driving discussion at several major events last month. The global cries for energy reduction, which have been mainstream since the early 1970s on the political level, have now moved to being real economic realities for component and systems suppliers. Chipmakers are finding that lower power makes good economic sense—lower cost of packaging, lower cost... » read more

A Warmer Reception
By Ed Sperling - 08 Sep, 2011 - Comments: 0

For years data center operations managers have been complaining that they can no longer cool racks of servers enough to bring them down to the maximum temperature. The increasing density of chips, thinner servers packed more tightly together and the usual current leakage have become so bad that it’s impossible to blow enough cool air through the server cabinets. In fact, it’s gotten to the ... » read more

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