tag: IC Insights

Week In Review: Manufacturing, Test
By Mark LaPedus - 30 Nov, 2018 - Comments: 0

Chipmakers GlobalFoundries has announced that its advanced silicon-germanium (SiGe) offering is available for prototyping on 300mm wafers. GF’s SiGe technology has been shipping on its 200mm production line in Burlington, Vt. The technology, a 90nm SiGe process, is moving to 300mm wafers at GF’s Fab 10 facility in East Fishkill, N.Y. The SiGe technology is called 9HP. “The increasing ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 21 Nov, 2018 - Comments: 0

R&D Imec and CEA-Leti have signed a memorandum of understanding under which the two R&D organizations will form a strategic partnership in the domains of artificial intelligence and quantum computing. Europe hopes to accelerate its effort in both AI and quantum computing. Market research TrendForce announced the ranking of top 10 fabless IC design houses worldwide based on their revenues f... » read more

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 21 Nov, 2018 - Comments: 0

Internet of Things Forrester Research released its 2019 Internet of Things predictions. Some key points: Bundled service offerings will catalyze a sleepy consumer IoT market; cybercriminals will lay siege to a smart-city implementation; and a market for IoT managed services will emerge in 2019. Black Friday and Cyber Monday are coming up. Those days present some opportunities to purchase ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 26 Oct, 2018 - Comments: 0

Chipmakers GlobalFoundries and the Chengdu municipality have signed an amendment and changed the strategy of their joint fab investment in Chengdu, China. Originally, GlobalFoundries was supposed to install 180nm/130nm processes in the China-based 300mm fab. The partners have decided to bypass that technology. Intead, the fab will start with GlobalFoundries’ 22nm FD-SOI process. “Ch... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 28 Sep, 2018 - Comments: 0

Tariffs The Federal Communications Commission (FCC) took a step in its ongoing efforts to remove regulatory barriers that inhibit the deployment of infrastructure necessary for 5G and other advanced wireless services in the U.S. "5G networks in America are key for powering the next generation of innovation, such as artificial intelligence, the Internet of Things and smart cities. (The FCC�... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 14 Sep, 2018 - Comments: 0

Fab/mask manufacturing An alliance of companies have formed the Center for Deep Learning in Electronics Manufacturing (CDLe). NuFlare, Mycronic and D2S have established the San Jose, Calif.-based center to advance the state-of-the-art in deep learning for its industry-specific applications. Imec.xpand, an early-stage and growth fund that is initiated by Imec, has closed its first fund at 11... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 31 Aug, 2018 - Comments: 0

Chipmakers GlobalFoundries said that it is putting its 7nm finFET program on hold indefinitely and has dropped plans to pursue technology nodes beyond 7nm. To be sure, it was a tough decision by GF to put 7nm on hold. But generally, analysts believe that GF made the right decision. “There’s only a handful of semiconductor companies that will require high-volume 7nm technology right when... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 24 Aug, 2018 - Comments: 0

Trade wars The United States and China have escalated the ongoing trade war. Both sides have implemented 25% tariffs on $16 billion worth of each other’s goods, according to a report from Reuters. The U.S. and China have slapped a combined $100 billion in tariffs on products since early July, according to the report. In testimony before a U.S. government interagency panel on considering t... » read more

Week In Review: Design, Low Power
By Jesse Allen - 17 Aug, 2018 - Comments: 0

Intel disclosed a speculative execution side-channel attack method called L1 Terminal Fault (L1TF). Leslie Culbertson, Intel's executive vice president and general manager of Product Assurance and Security, writes: "This method affects select microprocessor products supporting Intel Software Guard Extensions (Intel SGX) and was first reported to us by researchers at KU Leuven University, Techni... » read more

Next-Gen Memory Ramping Up
By Mark LaPedus - 16 Aug, 2018 - Comments: 6

The next-generation memory market is heating up as vendors ramp a number of new technologies, but there are some challenges in bringing these products into the mainstream. For years, the industry has been working on a variety of memory technologies, including carbon nanotube RAM, FRAM, MRAM, phase-change memory and ReRAM. Some are shipping, while others are in R&D. Each memory type is di... » read more

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