tag: IC Insights

The Week In Review: Manufacturing
By Mark LaPedus - 31 Mar, 2017 - Comments: 0

Chipmakers At an event, Intel’s Technology and Manufacturing group outlined the company's vision. As part of the event, Intel reiterated what many are saying—the current node designations are meaningless and misleading. “For example, Intel estimates that its 14nm solution that has been out in the market since 2014 should be equal to 10nm solutions released by competitors in the near futu... » read more

The Week In Review: Design
By Jesse Allen - 31 Mar, 2017 - Comments: 0

M&A Siemens closed the acquisition of Mentor Graphics, making Mentor now part of Siemens' product lifecycle management (PLM) software business. The $4.5 billion deal, announced last November, brings Siemens into the IC design tool and embedded software markets and expands Siemens' multi-physics and electronic simulation capabilities in the growing digital twin space, which ties together ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 24 Mar, 2017 - Comments: 0

Chipmakers China’s IC industry is embarking on a recruitment drive to prepare for the operation of new fabs in 2018, according to TrendForce. “TrendForce’s latest analysis on China’s semiconductor sector reveals that the country’s domestic IC manufacturers are affecting the movement of industry talent worldwide as they continue to aggressively headhunt for senior managers and enginee... » read more

China: Fab Boom or Bust?
By Mark LaPedus - 16 Mar, 2017 - Comments: 2

China’s semiconductor industry continues to expand at a frenetic pace. At present there are nearly two dozen new fab projects in China. Whether all these fab projects get off the ground is not entirely clear because the dynamics in China remain fluid. What is clear is the motivation behind this building frenzy—China is trying to reduce its huge trade imbalance in ICs. The country continu... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 03 Mar, 2017 - Comments: 2

SPIE news At this week’s SPIE Advanced Lithography conference, the industry paid close attention to the progress of extreme ultraviolet (EUV) lithography. Here’s the general report card: EUV is making noticeable progress, but there are still some challenges ahead, such as the power source, resists and pellicles. Several issues need to be resolved before chipmakers can put EUV into mass... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 24 Feb, 2017 - Comments: 0

Chipmakers Recently, Intel announced plans to invest more than $7 billion to complete its previously-announced fab in Chandler, Ariz. Targeted for 7nm processes, Fab 42 will be completed in 3 to 4 years. As reported, the fab announcement was made by U.S. President Donald Trump and Intel CEO Brian Krzanich at the White House. There is more to the story. Typically, Intel has two fabs for a gi... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 17 Feb, 2017 - Comments: 0

Chipmakers Toshiba’s problems have gone from bad to worse. “Toshiba postponed its earnings call by up to one month, and the chairman resigned. The provisional results show large losses in its nuclear power business, while the NAND operations remain very profitable,” said Weston Twigg, an analyst with Pacific Crest Securities, in a research note. “The next few months appear very uncerta... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 27 Jan, 2017 - Comments: 0

Chipmakers Faced with a huge write-down at its nuclear operations, Toshiba is looking to spin off its semiconductor division, which makes NAND. As expected, Toshiba seeks investors in the new company, according to Nikkei. Western Digital (WD) is one potential investor. Foxconn is another possible investor, according to CNBC. Peregrine Semiconductor has rolled out its latest RF SOI process.... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 20 Jan, 2017 - Comments: 0

Chipmakers 2017 is just getting underway and there appears to be more restructuring in the IC industry. Toshiba is looking to spin off its semiconductor division and Western Digital (WD) plans to take a minority stake, according to Nikkei, which added that Toshiba would sell a 20% stake for 200-300 billion yen ($1.78-$2.65 billion). “The arrangement would provide Toshiba with short term fund... » read more

China Unveils Memory Plans
By Mark LaPedus - 19 Jan, 2017 - Comments: 2

Backed by billions of dollars in government funding, China in 2014 launched a major initiative to advance its domestic semiconductor, IC-packaging and other electronic sectors. So far, though, the results are mixed. China is making progress in IC-packaging, but the nation’s efforts to advance its domestic logic and memory sectors are still a work in progress. In fact, China has yet to achi... » read more

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