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Preventing Chips From Burning Up During Test


It’s become increasingly difficult to manage the heat generated during IC test. Absent the proper mitigations, it’s easy to generate so much heat that probe cards and chips literally can burn up. As a result, implementing temperature-management techniques is becoming a critical part of IC testing. “We talk about systems, saying the system is good,” said Arun Krishnamoorthy, senior... » read more

Making IC Test Faster And More Accessible: Part 2


Recently, my colleague Robert Ruiz described a new approach to scan test that utilizes the high-speed I/O (HSIO) ports that exist on most chips. The benefits of this new approach include reduced test time and cost thanks to the high-speed interface. Simplified pin electronics and tester setup are also benefits, as is the ability to run manufacturing tests in the field in support of silicon life... » read more

Making IC Test Faster And More Accessible: Part 1


The fundamental challenges of IC test have been the same for a long time. At the heart of all test strategies is controllability and observability. First, control the state of the chip with known test vectors and then observe the chip to determine if it exhibits good or faulty behavior. There have been many innovations over the years to make the required testing of chips more tractable. Thanks ... » read more