tag: IEEE

Chip Industry Week In Review
By The SE Staff - 26 Jul, 2024 - Comments: 0

The U.S. Department of Commerce and Amkor Technology signed a deal to provide up to $400 million in funding, under the CHIPS and Science Act, to build a previously announced end-to-end advanced packaging plant. The combined funding is expected to total about $2 billion. The new facility will add some 2,000 jobs in Peoria, Arizona. The SK hynix Board approved its Yongin Semiconductor Cluster... » read more

Chip Industry Week In Review
By The SE Staff - 21 Jun, 2024 - Comments: 0

BAE Systems and GlobalFoundries are teaming up to strengthen the supply of chips for national security programs, aligning technology roadmaps and collaborating on innovation and manufacturing. Focus areas include advanced packaging, GaN-on-silicon chips, silicon photonics, and advanced technology process development. Onsemi plans to build a $2 billion silicon carbide production plant in the ... » read more

Ruthenium Interconnects On Tap
By Katherine Derbyshire - 20 Jun, 2024 - Comments: 0

Chipmakers' focus on new interconnect technology is ramping up as copper's effectiveness continues to diminish, setting the stage for a significant shift that could improve performance and reduce heat at future nodes and in advanced packages. The introduction of copper interconnects in 1997 upended the then-standard tungsten via/aluminum line metallization scheme. Dual damascene integration ... » read more

Private Delegated Computations Using Strong Isolation
By Arm - 14 Feb, 2024 - Comments: 0

Computations are now routinely delegated to third-parties. In response, Confidential Computing technologies are being added to microprocessors offering a trusted execution environment (TEE) that provides confidentiality and integrity guarantees to code and data hosted within—even in the face of a privileged attacker. TEEs, along with an attestation protocol, permit remote third-parties to est... » read more

Navigating Heat In Advanced Packaging
By Gregory Haley - 18 Jan, 2024 - Comments: 0

The integration of multiple heterogeneous dies in a package is pivotal for extending Moore’s Law and enhancing performance, power efficiency, and functionality, but it also is raising significant issues over how to manage the thermal load. Advanced packaging provides a way to pack more features and functions into a device, increasingly by stacking various components vertically rather than ... » read more

Setting Standards For The Chip Industry
By Karen Heyman - 07 Sep, 2023 - Comments: 2

For all the advances in semiconductor design, and the astonishing scales on which the industry now works, when it comes to standards committee meetings, not much has changed. Advice from a 91-year-old retired engineer can sound surprisingly like advice from those active today. Standards were then, and continue to be, a mix of technical compromises and corporate politics, as well as passionate a... » read more

Why It’s So Difficult To Ensure System Safety Over Time
By Brian Bailey - 14 Aug, 2023 - Comments: 0

Safety is emerging as a concern across an increasing number of industries, but standards and methodologies are not in place to ensure electronic systems attain a defined level of safety over time. Much of this falls on the shoulders of the chip industry, which provides the underlying technology, and it raises questions about what more can be done to improve safety. A crude taxonomy recently ... » read more

Systematic Yield Issues Now Top Priority At Advanced Nodes
By Laura Peters - 06 Dec, 2022 - Comments: 0

Systematic yield issues are supplanting random defects as the dominant concern in semiconductor manufacturing at the most advanced process nodes, requiring more time, effort, and cost to achieve sufficient yield. Yield is the ultimate hush hush topic in semiconductor manufacturing, but it's also the most critical because it determines how many chips can be profitably sold. "At older nodes, b... » read more

Advances In Reconfigurable Intelligent Surfaces Hardware Architectures: Beyond 5G/6G
By Technical Paper Link - 19 Aug, 2022 - Comments: 0

This technical paper titled "Reconfigurable Intelligent Surfaces for Wireless Communications: Overview of Hardware Designs, Channel Models, and Estimation Techniques" is from researchers at IEEE. The paper's abstract states "we overview and taxonomize the latest advances in RIS [reconfigurable intelligent surfaces] hardware architectures as well as the most recent developments in the modelin... » read more

Technical Paper Round-Up: July 5
By Linda Christensen - 05 Jul, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=36 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for... » read more

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