IoT Merging Into Data-Driven Design


The Internet of Things is becoming more difficult to define and utilize for an effective business strategy. While an increasing number devices send data to the cloud or some local server, so much data is being generated and moved around that new strategies are being developed to rethink what needs to be processed where. Back in 2013, when the IoT concept really began taking off, connectivity... » read more

Manufacturing Bits: Jan. 2


Better nanowire MOSFETs At the recent IEEE International Electron Devices Meeting (IEDM), Imec and Applied Materials presented a paper on a new and improved way to fabricate vertically stacked gate-all-around MOSFETs. More specifically, Imec and Applied reported on process improvements for a silicon nanowire MOSFET, which is integrated in a CMOS dual work function metal replacement metal ga... » read more

Week In Review: Manufacturing, Test


Fab tools/manufacturing Lam Research has accepted Martin Anstice’s resignation as chief executive and a member of the board. Lam has named Tim Archer as president and chief executive effective immediately. Archer, who served as Lam’s president and chief operating officer, has been named to the board. One analyst provided a comment on the situation at Lam. “In our view, Mr. Archer is very... » read more

Week In Review: Manufacturing, Test


Chipmakers GlobalFoundries has announced that its advanced silicon-germanium (SiGe) offering is available for prototyping on 300mm wafers. GF’s SiGe technology has been shipping on its 200mm production line in Burlington, Vt. The technology, a 90nm SiGe process, is moving to 300mm wafers at GF’s Fab 10 facility in East Fishkill, N.Y. The SiGe technology is called 9HP. “The increasing ... » read more

Getting Down To Business On Chiplets


Government agencies, industry groups and individual companies are beginning to rally around various chiplet models, setting the stage for complex chips that are quicker and cheaper to build using standardized interfaces and components. The idea of putting together different modules like LEGOs has been talked about for the better part of a decade. So far, only Marvell has used this concept co... » read more

Manufacturing Bits: Oct. 23


3D stacked finFETs At the upcoming 2018 IEEE International Electron Devices Meeting (IEDM), Imec is expected to present a paper on a 3D stacked finFET architecture. IEDM is slated from Dec. 1-5 in San Francisco. Imec’s technology is based what on the R&D organization calls sequential integration. Another R&D organization, Leti, calls it 3D monolithic integration. Regardless, the idea... » read more

Week In Review: Manufacturing, Test


Chipmakers GlobalFoundries has announced the addition of nine new partners to its RFwave Partner Program, including AkronIC, Ask Radio, Catena, University of Waterloo Centre for Intelligent Antenna and Radio Systems (CIARS), Giga Solution, Helic, Incize, Mentor Graphics and Xpeedic Technology. The RFwave Partner Program builds upon GF’s radio-frequency (RF) efforts. The new partners will pro... » read more

Week In Review: Manufacturing, Test


Tariffs The Federal Communications Commission (FCC) took a step in its ongoing efforts to remove regulatory barriers that inhibit the deployment of infrastructure necessary for 5G and other advanced wireless services in the U.S. "5G networks in America are key for powering the next generation of innovation, such as artificial intelligence, the Internet of Things and smart cities. (The FCC... » read more

Week In Review: Manufacturing, Test


Tariffs The Office of the U.S. Trade Representative (USTR) has released a list of $200 billion worth of Chinese imports that will be subject to tariffs. These actions are on top of another set of tariffs, which were put in place. The additional tariffs will be effective starting Sept. 24, and initially will be in the amount of 10%. Starting Jan. 1, 2019, the level of the additional tariffs wi... » read more

Week In Review: Manufacturing, Test


Fab/mask manufacturing An alliance of companies have formed the Center for Deep Learning in Electronics Manufacturing (CDLe). NuFlare, Mycronic and D2S have established the San Jose, Calif.-based center to advance the state-of-the-art in deep learning for its industry-specific applications. Imec.xpand, an early-stage and growth fund that is initiated by Imec, has closed its first fund at 11... » read more

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