Week In Review: Design, Low Power


Si2's Unified Power Model has been approved as IEEE 2416-2019, a new Standard for Power Modeling to Enable System Level Analysis, which complements UPF/IEEE 1801-2018. UPM/IEEE 2416-2019 provides a set of power modeling semantics enabling system designers to model entire systems with flexibility. It supports power modeling from abstract design description to gate level implementation, providing... » read more

System Bits: July 3


CMU prof gets a shot at new supercomputer The National Energy Research Scientific Computing Center will greet its Perlmutter supercomputing system in early 2020. The Cray-designed machine will be capable of 100 million billion floating operations per second. Zachary Ulissi of Carnegie Mellon University will be among the first researchers to use the supercomputer. "When this machine comes on... » read more

Manufacturing Bits: June 25


Panel-level consortium Fraunhofer is moving forward with the next phase of its consortium to develop technologies for panel-level packaging. In 2016, Fraunhofer launched the original effort, dubbed the Panel Level Packaging Consortium. The consortium, which had 17 partners, developed various equipment and materials in the arena. Several test layouts were designed for process development on ... » read more

Telle Whitney Receives IEEE Honorary Membership


On May 17 Telle Whitney received the 2019 IEEE Honorary Membership at the 2019 IEEE Vision, Innovation, and Challenges Summit (IEEE VIC Summit) in San Diego for leadership in supporting and promoting women in technology, and for building a highly impactful global organization dedicated to this purpose. Sponsored by IEEE, the grade of Honorary Member is a significant honor bestowed by IEEE a... » read more

Manufacturing Bits: June 10


Predicting warpage in packages At the recent IEEE Electronic Components and Technology Conference (ECTC) in Las Vegas, there were several papers on ways to predict variation and warpage in IC packages. Advanced packages are prone to unwanted warpage during the process flow. The warpage challenges escalate as the packages become thinner. Warpage in turn can impact yields in IC packages. ... » read more

ECTC Packaging Trends


At the recent IEEE Electronic Components and Technology Conference (ECTC) in Las Vegas, a number of packaging houses, R&D organizations and universities presented a slew of papers on the latest IC packaging technologies. The event provided a glimpse of the future of packaging, which is becoming more important in the industry. At one time, IC packaging took a backseat in the semiconductor... » read more

Manufacturing Bits: June 4


Chiplet printer A number of companies, R&D organizations and universities separately presented a slew of papers and technologies at the recent IEEE Electronic Components and Technology Conference (ECTC) in Las Vegas. It’s difficult to write about all of the papers at ECTC. But one paper that stood out is a prototype chiplet micro-assembly printer developed by the Palo Alto Research Cente... » read more

Focus Shifting From 2.5D To Fan-Outs For Lower Cost


Semiconductor Engineering sat down to discuss advanced packaging with Calvin Cheung, vice president of engineering at ASE; Walter Ng, vice president of business management at UMC; Ajay Lalwani, vice president of global manufacturing operations at eSilicon; Vic Kulkarni, vice president and chief strategist in the office of the CTO at ANSYS; and Tien Shiah, senior manager for memory at Samsung. W... » read more

Week In Review: Manufacturing, Test


Materials Wesfarmers, an Australian diversified firm, has made an unsolicited bid to acquire Lynas, one of the world’s largest suppliers of rare earths outside of China. Rare earths are chemical elements found in the Earth’s crust. They are used in cars, consumer electronics, computers, communications, clean energy and defense systems. The big market for rare earths is magnets. In semicond... » read more

Week In Review: Manufacturing, Test


Chipmakers and OEMs Cypress Semiconductor has received regulatory antitrust approval for the closing of its previously-announced joint venture with SK Hynix. The new joint venture, SkyHigh Memory, will provide single-level cell (SLC) NAND memory solutions. Cree has announced the execution of a definitive agreement to sell its Lighting Products business unit (Cree Lighting), which includes t... » read more

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