New Starting Point


Debate has been raging for years about whether software or hardware should be the starting point for improving power and performance, or whether it should elevated another notch by fusing hardware and software into a system-level approach. Now, groups like Leti, IEEE, SEMI, and a number of researchers in leading universities around the globe are beginning to talk about moving the starting point... » read more

Advanced Packaging Options, Issues


Systems in package are heading for the mass market in applications that demand better performance and lower power. As they do, new options for cutting costs are being developed to broaden the appeal of this approach as an alternative to shrinking features. Cost has been one of the big deterrents for widespread adoption of [getkc id="82" kc_name="2.5D"]. Initially, the almost universal compla... » read more

Photonics Moves Closer To Chip


Silicon photonics is resurfacing after more than a decade in the shadows, driven by demands to move larger quantities of data faster, using extremely low power and with minimal heat. Until recently, much of the attention in photonics focused on moving data between servers and storage. Now there is growing interest at the PCB level and in heterogeneous multi-chip packages. Government, academi... » read more

How To Build Systems In Package


The semiconductor industry is racing to define a series of road maps for semiconductors to succeed the one created by the ITRS, which will no longer be updated, including a brand new one focused on heterogeneous integration. The latest entry will establish technology targets for integration of heterogeneous multi-die devices and systems. It has the support of IEEE's Components, Packaging and... » read more

Open Standards For Verification?


The increasing use of verification data for analyzing and testing complex designs is raising the stakes for more standardized or interoperable database formats. While interoperability between databases in chip design is not a new idea, it has a renewed sense of urgency. It takes more time and money to verify increasingly complex chips, and more of that data needs to be used earlier in the fl... » read more

Going Open Source


Open Source often is thought of as an alternative to commercial software licensed using fairly typical business models. For example, variants of open source Linux supplied by companies such as Red Hat charge a subscription for support and maintenance. Maybe there is an opportunity to leverage Open Source alongside commercial EDA software to provide use model advantages and open development f... » read more

The Other Side Of Device Scaling


The push to 10nm and 7nm is a relatively straightforward path in PowerPoint. In multiple presentations across the semiconductor industry, in fact, it has been portrayed as a straight line progression spanning decades. While most chipmakers are aware that the cost per transistor has been increasing below 22nm, due to double patterning and the challenges in designing finFETs and dealing with d... » read more

The Week In Review: Design/IoT


Standards The IEEE launched the International Roadmap for Devices and Systems (IRDS), effectively setting the industry agenda for future silicon benchmarking and adding metrics that are relevant to specific markets rather than creating the fastest general-purpose processing elements at the smallest process node. For more on the IRDS, check out Ed Sperling's analysis. Accellera's SystemC A... » read more

Why This Roadmap Matters


The semiconductor industry is now officially looking beyond PCs and servers, establishing metrics and guidance for existing and developing market segments rather than just focusing on how to get to the next process nodes. The IEEE's International Roadmap for Devices and Systems marks a fundamental shift in the industry. The uncertainty that has ensued ever since the introduction of 3D transi... » read more

Rethinking Processor Architectures


The semiconductor industry's obsession with clock speeds, cores and how many transistors fit on a piece of silicon may be nearing an end for real this time. The [getentity id="22048" comment="IEEE"] said it will develop the International Roadmap for Devices and Systems (IRDS), effectively setting the industry agenda for future silicon benchmarking and adding metrics that are relevant to specifi... » read more

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