IoT Startups Rake In Cash


Corporate and venture investors are still eagerly backing Internet of Things startups, with more than $850 million committed during the first six months of 2017. This year’s total may not reach the heights of 2014, when investors put more than $5 billion into IoT startups, or 2016, which saw IoT firms receiving about $4.75 billion, the Venture Scanner website estimates. Still, a once white... » read more

EDA Moves Out Of The Shadows


EDA has long harbored ambitions that are larger than a piece of silicon. The engineering challenges being solved on a nanometric scale are remarkably similar to ones being solved at a much higher level—architectural design, layout, validation, verification, debug, thermal mapping, and a lot more. The problem, at least until recently, is that it has been difficult to gain a foothold in larg... » read more

Safety Plus Security: Solutions And Methodologies


By Ed Sperling & Brian Bailey As more technology makes its way into safety-critical markets—and as more of those devices are connected to the Internet—security issues are beginning to merge with safety issues. The number of attempted cyberattacks is up on every front, which has big implications for devices used in safety-related applications. There are more viruses, ransomware, an... » read more

The Week In Review: IoT


Finance Samsara, an Industrial Internet of Things startup, raised $40 million in its Series C financing, led by General Catalyst. Andreesen Horowitz, an existing investor, and Samsara’s founders also participated in the funding round, which values the company at $530 million. The supplier of Internet-connected sensors for industrial and transportation applications has raised a total of $80 m... » read more

The Week In Review: IoT


Market Research International Data Corp. updated its Worldwide Semiannual Internet of Things Spending Guide, forecasting global IoT spending will increase 16.7% this year to more than $800 billion. The market research firm says the market will grow to almost $1.4 trillion by 2021. Manufacturing, smart grid technologies, freight monitoring, production asset management, and smart building techno... » read more

The Week In Review: IoT


Analysis Adam Greenfield writes about the privacy and technology issues raised by the Internet of Things in this piece, an adapted extract from his new book, "Radical Technologies: The Design of Everyday Life." “The Internet of Things presents many new possibilities, and it would be foolish to dismiss those possibilities out of hand. But we would also be wise to approach the entire domain wi... » read more

Listening To The Voice Of Your Product


Much has been said and written about the business values of the Industrial Internet of Things (IIoT). Through connecting the manufacturing elements (machines) on the factory floor, and collecting and analyzing their data, manufacturers can significantly improve the efficiency and profitability of their operations through intelligent predictive maintenance of equipment and optimal equipment ut... » read more

IoT Security Challenges, Opportunities


The specter of cybersecurity is haunting the Internet of Things—or more specifically, the lack of it. Big companies in information technology and telecommunications have embraced the [getkc id="76" kc_name="IoT"] as a significant business opportunity, and the field is inspiring hundreds of startups in Silicon Valley and elsewhere. Venture capitalists hungrily eye the IoT, betting on which ... » read more

The Week In Review: IoT


Analysis Whither Intel’s Internet of Things efforts? “While Intel's IoT business certainly won't solve its ongoing troubles in the PC and data center markets anytime soon, staying invested in that market will ensure that the chipmaker doesn't miss another major technological shift, as it did with mobile devices about a decade ago,” Leo Sun writes in this analysis. Products Cisco Sys... » read more

Samsung Unveils Scaling, Packaging Roadmaps


Samsung Foundry unveiled an aggressive roadmap that scales down to 4nm, and which includes a fan-out wafer-level packaging technology that bridges chips in the redistribution layer, 18nm FD-SOI, and a new organizational structure that allows the unit much greater autonomy as a commercial enterprise. The moves put [getentity id="22865" e_name="Samsung Foundry"] in direct competition with [get... » read more

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