tag: imec

Week In Review: Manufacturing, Test
By Mark LaPedus - 14 Sep, 2018 - Comments: 0

Fab/mask manufacturing An alliance of companies have formed the Center for Deep Learning in Electronics Manufacturing (CDLe). NuFlare, Mycronic and D2S have established the San Jose, Calif.-based center to advance the state-of-the-art in deep learning for its industry-specific applications. Imec.xpand, an early-stage and growth fund that is initiated by Imec, has closed its first fund at 11... » read more

Cobalt Shortages Ahead
By Mark LaPedus - 10 Sep, 2018 - Comments: 0

Rapid growth of electric vehicles is creating an enormous demand for cobalt, causing tight supply, high prices and supply chain issues for this critical material. Cobalt is a ferromagnetic metal and one of the key materials used in lithium-ion batteries for cell phones, notebook PCs, battery-electric cars and hybrids. It also is used in alloys and semiconductors. And while the IC industry co... » read more

Manufacturing Bits: Aug. 21
By Mark LaPedus - 21 Aug, 2018 - Comments: 1

World’s smallest transistor The Karlsruhe Institute of Technology (KIT) has developed what researchers say is the world’s smallest transistor. Researchers have devised a single-atom transistor. The transistor switches an electrical current via a single atom, which resides in a gel electrolyte. The device also works at room temperature. While others have developed single-atom transist... » read more

3D NAND Flash Wars Begin
By Mark LaPedus - 20 Aug, 2018 - Comments: 0

3D NAND suppliers are gearing up for a new battle amid a period of price and competitive pressures, racing each other to the next technology generations. Competition is intensifying as a new player enters the 3D NAND market—China’s Yangtze Memory Technologies Co. (YMTC). Backed by billions of dollars in funding from the Chinese government, YMTC recently introduced its first 3D NAND techn... » read more

Manufacturing Bits: Aug. 7
By Mark LaPedus - 07 Aug, 2018 - Comments: 0

DNA ROMs The National Science Foundation (NSF) and the Semiconductor Research Corp. (SRC) are investing $12 million to develop a new class of memories and other technologies, such as DNA-based read-only memory (ROM), nucleic acid memory (NAM) and neural networks based on yeast cells. The effort is called the Semiconductor Synthetic Biology for Information Processing and Storage Technologies... » read more

Manufacturing Bits: July 31
By Mark LaPedus - 31 Jul, 2018 - Comments: 0

Florida R&D fab A new microelectronics R&D initiative in Florida is expanding its operations and readying its new 200mm fab facility. The initiative, called BRIDG, describes itself as a non-profit, public-private partnership. BRIDG is basically an R&D microelectronics facility, which is focusing on the development of select technologies, such as photonics, sensors, imagers and 2.5D/3D pac... » read more

Leti’s Next Focus
By Mark LaPedus - 19 Jul, 2018 - Comments: 0

Emmanuel Sabonnadière, chief executive of Leti, sat down with Semiconductor Engineering to discuss R&D trends, a new deal with Soitec, and the latest developments at the France-based research organization. Leti is a research institute of CEA Tech. What follows are excerpts of that conversation. SE: Leti recently formed an alliance with Soitec. Under the terms, Leti and Soitec are formin... » read more

Bridges Vs. Interposers
By Mark LaPedus - 12 Jul, 2018 - Comments: 4

The number of technology options continue to grow for advanced packaging, including new and different ways to incorporate so-called silicon bridges in products. For some time, Intel has offered a silicon bridge technology called Embedded Multi-die Interconnect Bridge (EMIB), which makes use of a tiny piece of silicon with routing layers that connects one chip to another in an IC package. In ... » read more

Manufacturing Bits: July 10
By Mark LaPedus - 10 Jul, 2018 - Comments: 0

Ruthenium interconnects Imec has developed a process to enable ruthenium (Ru) interconnects in chips at 5nm and beyond. Ru is one of several candidates to replace traditional copper as the interconnect material in chips. The interconnects, which reside on the top of the transistor, consist of tiny copper wiring schemes that transfer electrical signals from one transistor to another. The int... » read more

Where Is Selective Deposition?
By Mark LaPedus - 25 Jun, 2018 - Comments: 4

For years, the industry has been working on an advanced technology called area-selective deposition for chip production at 5nm and beyond. Area-selective deposition, an advanced self-aligned patterning technique, is still in R&D amid a slew of challenges with the technology. But the more advanced forms of technology are beginning to make some progress, possibly inching closer from the la... » read more

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