Week In Review: Design, Low Power


M&A Infineon Technologies will acquire Cypress Semiconductor for $23.85 per share in cash, or $10.1 billion. The deal will place Infineon as the number eight chip manufacturer in the world based on 2018 revenues and create an automotive powerhouse, making the combined company the largest supplier of chips to the automotive market. Infineon sees potential to reach into new industrial and co... » read more

IoT Device Security Makes Slow Progress


Semiconductor Engineering sat down with Chris Jones, vice president of marketing at Codasip; Martin Croome, vice president of business development at GreenWaves Technologies; Kevin McDermott, vice president of marketing at Imperas; Scot Morrison, general manager, embedded platform technology at Mentor, a Siemens Business; Lauri Koskinen, CTO at Minima; and Mike Borza, principal security technol... » read more

Week In Review: Design, Low Power


RISC-V Western Digital announced big plans for RISC-V with a new open source RISC-V core, an open standard initiative for cache coherent memory over a network, and an open source RISC-V instruction set simulator. The SweRV Core features a 2-way superscalar design with a 32-bit, 9 stage pipeline core. It has clock speeds of up to 1.8Ghz on a 28mm CMOS process technology and will be used in vari... » read more

Week In Review: Design, Low Power


M&A SMIT Holdings acquired S2C, a provider of FPGA prototyping hardware and software as well as interfaces and accessories, for $19 million, plus up to US$2 million in milestone based payments to the key management team. S2C was founded in 2003. SMIT, based in Hong Kong, makes pay TV broadcasting access and mobile point-of-sale payment systems for the Chinese market. Tools & IP Syn... » read more

Week In Review: Design, Low Power


Arm announced its new roadmap promising 30% annual system performance gains on leading edge nodes through 2021. These gains are to come from a combination of microarchitecture design to hardware, software and tools. They are branding this new roadmap 'Neoverse.' The first delivery will be Ares – expected in early 2019 – for a 7nm IP platform targeting 5G networks and next-generation cloud t... » read more

RISC-V: More Than a Core


The open-source RISC-V instruction set architecture (ISA) is attracting a lot of attention across the semiconductor industry, but its long-term success will depend on levels of cooperation never seen before in the semiconductor industry. The big question now is how committed the industry is to RISC-V's success. The real value that RISC-V brings is the promise of an ecosystem and the opportun... » read more

RISC-V Inches Toward The Center


RISC-V is pushing further into the mainstream, showing up across a wide swath of designs and garnering support from a long and still-growing list of chipmakers, tools vendors, universities and foundries. In most cases it is being used as a complementary processor than a replacement for something else, but that could change in the future. What makes RISC-V particularly attractive to chipmaker... » read more

Design Reuse Vs. Abstraction


Chip designers have been constantly searching for a hardware description language abstraction level higher than RTL for a few decades. But not everyone is moving in that direction, and there appear to be enough options available through design reuse to forestall that shift for many chipmakers. Pushing to new levels of abstraction is frequent topic of discussion in the design world, particula... » read more

Searching For A System Abstraction


Without abstraction, advances in semiconductor design would have stalled decades ago and circuits would remain about the same size as analog blocks. No new abstractions have emerged since the 1990s that have found widespread adoption. The slack was taken up by IP and reuse, but IP blocks are becoming larger and more complex. Verification by isolation is no longer a viable strategy at the system... » read more

DAC 2018: System Design, Cloud And Machine Learning


This marks the 10th DAC that I have covered as a blogger. At DAC 2008 in Anaheim, the industry had just come together behind the SystemC TLM 2.0 standard to enable virtual platforms, finally getting to model interoperability. System design is the common thread that is also present in this year’s DAC in 2018 in San Francisco. But a lot has changed. Big data analytics, artificial intelligence a... » read more

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