Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 02 Jul, 2020 - Comments: 0

The American Foundries Act, a bipartisan initiative to revive U.S. leadership in the global microelectronics sector, was announced by U.S. Democratic Senator Chuck Schumer from New York. “The economic and national security risks posed by relying too heavily on foreign semiconductor suppliers cannot be ignored, and Upstate New York, which has a robust semiconductor sector, is the perfect place... » read more

Brains And Computers At The VLSI Design Conference

By Madhavi Rao - 16 Jan, 2020 - Comments: 0

One of the industry’s biggest events, the VLSI Design Conference, took place in Bangalore last week. This conference does a round-robin of cities, and this was the 10th time in its 33-year history that Bangalore was hosting it (the last time was in 2015). This year’s conference attracted over 1,800 technologist and leaders over five days – a huge turnout for this growing industry. Inci... » read more

November 2019 Startup Funding

By Jeff Dorsch - 05 Dec, 2019 - Comments: 0

During November, 16 tech startups raised private funding rounds of $100 million or more, together receiving $3.42 billion. Investors were drawn to many of the same technology fields that were popular in 2019 — automotive and mobility tech, artificial intelligence and machine learning, cybersecurity, platforms, semiconductors, and software. Analytics of multiple different types were big in ... » read more

RISC-V Markets, Security And Growth Prospects

By Ed Sperling - 18 Nov, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss open instruction set hardware with Ben Levine, senior director of product management in Rambus' Security Division; Jerry Ardizzone, vice president of worldwide sales at Codasip; Megan Wachs, vice president of engineering at SiFive; and Rishiyur Nikhil, CTO of Bluespec. What follows are excerpts of that conversation. Part one of this discussion is ... » read more

Week in Review: IoT, Security, Autos

By Jeff Dorsch - 23 Aug, 2019 - Comments: 0

Products/Services Huawei Technologies is again delaying the public introduction of its Mate X foldable smartphone. It is unlikely the product will be marketed in the U.S., given the ongoing trade war. The official rollout now seems likely to come in November, in time for the holiday shopping season. Samsung Electronics has had its problems with foldable phones, yet those were due to manufactur... » read more

March’19 Startup Funding: Money Springs Forth

By Jeff Dorsch - 04 Apr, 2019 - Comments: 0

Another month, another couple of billion-dollar rounds. Singapore-based Grab raised nearly $1.5 billion from the SoftBank Vision Fund, bringing its total private funding to more than $4.5 billion and valuing the company at around $14 billion. Grab has acquired Uber’s ride-hailing business in Southeast Asia and now competes chiefly with Go-Jek of Indonesia in Thailand and other emerging mar... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 22 Mar, 2019 - Comments: 0

Internet of Things Second-tier cities in the U.S. that can’t attract projects like the Amazon HQ2 are welcoming the testing of autonomous vehicles, smart city technology, and advanced surveillance techniques, this analysis notes. What do they get in return? Much of the time, little or nothing. And bad things can happen. People have been throwing objects at Waymo vehicles in Chandler, Ariz., ... » read more

Engineering Talent Shortage Now Top Risk Factor

By Mark LaPedus - 25 Feb, 2019 - Comments: 16

Demand is increasing for engineers and related technical fields in the IC industry, but companies are struggling to find enough talent. The problem is even worse in hot new markets such as AI and 5G, where competition is fierce for experienced workers. The talent shortfall starts with college graduates and professionals in the fields of science, technology, engineering and mathematics (STEM)... » read more

Blog Review: Feb. 21

By Jesse Allen - 21 Feb, 2018 - Comments: 0

Mentor's Colin Walls posits that one part of the reason modern code has so many bugs may be the way we talk about them, and it's time for a change in terminology. Following up on a post about the challenges of bringing digital literacy to an area where many are unable to read, Cadence's Madhavi Rao looks at the impact agriculture-focused IoT technologies could have on rural areas in India. ... » read more

Bidding War On H-1B Visas?

By Ed Sperling - 26 Jan, 2017 - Comments: 3

Good help is hard to find. It's about to get harder—and more expensive. The U.S. tech industry's solution until now has been to leverage expertise from around the world, drawing top graduates and entry-level professionals under the H-1B visa program. Last year, there were 85,000 H-1B visas issued, of which 20,000 are required to hold a U.S. master's degree or higher. There are some exce... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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