Chip Industry Technical Paper Roundup: May 6


New technical papers recently added to Semiconductor Engineering’s library: [table id=427 /] Find more semiconductor research papers here.   » read more

Investigation Of Self-Heating Effects on Fe-FinFETs On IMC Applications (TU Munich, IIT, U. Stuttgart)


A new technical paper titled "Investigating Self-Heating Effects in Ferroelectric FinFETs for Reliable In-Memory Computing" was published by researchers at TU Munich, University of Stuttgart and Indian Institute of Technology, Kanpur. Abstract "Ferroelectric (Fe) FET has emerged as a promising candidate for efficient in-memory computing due to its properties, such as non-volatility and lo... » read more

Impact Of Cryogenic Temps On The Minimum-Operating Voltage Of 5nm FinFETs-Based SRAM (IIT, UC Berkeley et al)


A new technical paper titled "An Investigation of Minimum Supply Voltage of 5nm SRAM from 300K down to 10K" was published by researchers at Indian Institute of Technology, UC Berkeley and Munich Institute of Robotics and Machine Intelligence. Abstract "In this article, we present a comprehensive study of the impact of cryogenic temperatures on the minimum-operating voltage (Vmin) of 5 nm ... » read more

Chip Industry Week In Review


Arm joined forces with Korea's Samsung Foundry, ADTechnology, and Rebellions to create a CPU chiplet platform for AI training and inference. The new chiplet will be based on Samsung's 2nm gate-all-around technology. Intel and AMD, arch competitors for decades, formed an x86 ecosystem advisory group to collaborate on architectural interoperability and simplify software development. Samsung... » read more

Research Bits: Jan. 8


High mobility graphene Researchers at the Georgia Institute of Technology and Tianjin University created a functional semiconductor made from graphene that is compatible with conventional microelectronics processing methods. "We now have an extremely robust graphene semiconductor with 10 times the mobility of silicon, and which also has unique properties not available in silicon," said Walt... » read more

Chip Industry’s Technical Paper Roundup: July 24


New technical papers recently added to Semiconductor Engineering’s library: [table id=119 /] More Reading Technical Paper Library home » read more

Gallium Oxide Flash Memory (KAUST & IIT)


A technical paper titled "Demonstration of β-Ga2O3 nonvolatile flash memory for oxide electronics" was published by researchers at King Abdullah University of Science and Technology (KAUST) and Indian Institute of Technology. Abstract: "This report demonstrates an ultrawide bandgap β-Ga2O3 flash memory for the first time. The flash memory device realized on heteroepitaxial β-Ga2O3 film... » read more

Chip Industry’s Technical Paper Roundup: May 2


New technical papers recently added to Semiconductor Engineering’s library: [table id=95 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us p... » read more

Hardware-Accelerated RTL Simulator


A technical paper titled "Manticore: Hardware-Accelerated RTL Simulation with Static Bulk-Synchronous Parallelism" was published by researchers at EPFL, University of Tokyo, Sharif University, and Indian Institute of Technology. Abstract "The demise of Moore's Law and Dennard Scaling has revived interest in specialized computer architectures and accelerators. Verification and testing of thi... » read more

Week In Review: Semiconductor Manufacturing, Test


U.S. President Joe Biden appears ready to increase pressure on Japan and the Netherlands to help block the flow of advanced chip technology to China, where it can be used to develop cutting-edge weapons. "You will see Japan and Netherlands follow our lead," U.S. Commerce Secretary Gina Raimondo told CNBC. Japan plans to budget ¥350 billion ($2.38 billion) in a research collaboration with th... » read more

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