Sustainable Rail Transportation With High Power SiC Modules: Part 2

By Diana Car - 10 Oct, 2024 - Comments: 0

In the first part of this blog, we had a look at how energy-efficient high-power modules contribute to the decarbonization of railway transportation. This part will focus on the future of traction: high-power silicon carbide modules, their key features, and the multiple system benefits they enable. Silicon carbide power modules and hybrid-propulsion trains: It’s a match! As we inch toward... » read more

Challenges In Reducing Wireless Latency

By Karen Heyman - 10 Oct, 2024 - Comments: 0

A new and much faster version of Wi-Fi is beginning to infiltrate the IoT market, reducing latency that has begun to creep up as more data is generated, processed, and moved wirelessly from one device to another. An estimated 20 billion connected devices are currently in use. Over the next several years, devices will start to include faster wireless connectivity, enabling more rapid transfer... » read more

Paving The Way For Sustainable AI

By Infineon - 10 Oct, 2024 - Comments: 0

Real-time requirements and the need for power-efficiency, security and privacy drives AI-processing at the edge. Key benefits of Edge AI include: -Low latency and real-time response -High power efficiency -Improved security and data privacy -Reduced cost A complementary set of AI-specific products and solutions, an end-to-end ML platform as well as an extensive application kno... » read more

Government Chip Funding Spreads Globally

By Liz Allan - 07 Oct, 2024 - Comments: 0

This is the first in a series of articles tracking government chip investments. See part two for Americas-focused funding and part three for the UK and EMEA, and part four for Asia. Countries around the world are ramping up investments into their semiconductor industries as part of new or existing approaches. The increased government activity stems from growing awareness of the strategic imp... » read more

Chip Industry Week In Review

By The SE Staff - 04 Oct, 2024 - Comments: 0

Amkor will provide turnkey advanced packaging and test services to TSMC in Amkor's planned facility in Peoria, Arizona, in a deal announced on Thursday. The companies jointly specified the packaging technologies, such as TSMC’s Integrated Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS). President Biden signed into law a bill that exempts some semiconductor projects funded by the U.S.... » read more

Chip Industry Week In Review

By The SE Staff - 27 Sep, 2024 - Comments: 0

Global spending on 300mm fab equipment is expected to reach a record US$400 billion from 2025 to 2027, according to SEMI. Key drivers are the regionalization of semiconductor fabs and the increasing demand for AI chips in data centers and edge devices, with China, South Korea, and Taiwan leading the way. The Biden-Harris Administration launched the National Semiconductor Technology Center’... » read more

Formal Verification Of A Mixed Signal IP with Both Digital And Analog Blocks

By Technical Paper Link - 25 Sep, 2024 - Comments: 0

A new technical paper titled "Analogous Alignments: Digital "Formally" meets Analog" was published by researchers at Infineon Technologies. Abstract: "The complexity of modern-day System-on-Chips (SoCs) is continually increasing, and it becomes increasingly challenging to deliver dependable and credible chips in a short time-to-market. Especially, in the case of test chips, where the aim is... » read more

Chip Industry Week In Review

By The SE Staff - 20 Sep, 2024 - Comments: 0

Synopsys agreed to sell its Optical Solutions Group to Keysight for an undisclosed amount, in a deal deemed necessary for Synopsys to win regulatory approval for its planned acquisition of Ansys. The sale to Keysight is contingent on the Synopsys-Ansys deal going through. Meanwhile, Ansys has its own optical business. The U.S. Department of Defense (DoD) made the first awards for Microelectr... » read more

Chip Industry Week In Review

By The SE Staff - 13 Sep, 2024 - Comments: 0

Infineon rolled out the world's first 300mm gallium nitride (GaN) wafer, opening the door for high-volume manufacturing of GaN-based power semiconductors. A 300mm wafer contains 2.3 times as many chips per wafer as a 200mm wafer. Fig.1: Infineon's 300mm GaN wafer. Source: Infineon The Semiconductor Industry Association released its 2024 State of the U.S. Semiconductor Industry report th... » read more

Balancing Programmability And Performance In Cars

By Ann Mutschler - 05 Sep, 2024 - Comments: 0

The rate of change in the automotive industry is accelerating with the shift toward software-defined vehicles and ongoing advancements in algorithms and chip architectures. The challenge now is to figure out the best way to prevent rapid obsolescence, improve safety, and keep the cost of these changes to a minimum. Today, updatable automotive hardware is typically achieved through FPGAs, but... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Infineon

Sustainable Rail Transportation With High Power SiC Modules: Part 2

Challenges In Reducing Wireless Latency

Paving The Way For Sustainable AI

Government Chip Funding Spreads Globally

Chip Industry Week In Review

Chip Industry Week In Review

Formal Verification Of A Mixed Signal IP with Both Digital And Analog Blocks

Chip Industry Week In Review

Chip Industry Week In Review

Balancing Programmability And Performance In Cars