Chip Industry Technical Paper Roundup: May 5


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations Rethinking Compute Substrates for 3D-Stacked Near-Memory LLM Decoding: Microarchitecture-Scheduling Co-Design 🔗 Univ. of Edinburgh, Peking Univ., Cambridge, CAS, HKUST In-SoIC ESD Protection for Chiplet-Based 3D Microsystems: Future Research Direct... » read more

Chip Industry Week in Review


Advanced nodes and capacity The US Commerce Dept. told IC equipment makers to stop shipments to Hua Hong Group, China's No. 2 chipmaker, in order to protect America's lead, according to Reuters. Global AI competition is causing wafer and packaging shortages, but capacity increases are expected to come online later this year and in 2027 to ease the crunch, according to TrendForce. Leadi... » read more

How Long Will CAN Stick Around As Rival Networks Speed Up?


Key Takeaways Automotive Ethernet is rapidly becoming the backbone of software-defined vehicles for higher bandwidth, scalability, and advanced features like TSN and security that legacy protocols cannot match. CAN, LIN, and other legacy networks will not disappear quickly because they are deeply embedded, low‑cost, and proven, but they are increasingly seen as inadequate for future A... » read more

Leveraging Agentic AI Techniques to Improve Formal Verification (Infineon, et al.)


A new technical paper, "Agentic AI-based Coverage Closure for Formal Verification," was published by researchers at Infineon and the NIT Jalandhar. Abstract "Coverage closure is a critical requirement in Integrated Chip (IC) development process and key metric for verification sign-off. However, traditional exhaustive approaches often fail to achieve full coverage within project timelines.... » read more

Chip Industry Week In Review


Acquisitions and business pivots Teradyne acquired Israel-based TestInsight, a semiconductor test provider with pattern conversion, validation, and virtual test capabilities. Credo plans to acquire DustPhotonics, a developer of silicon photonics PICs for optical transceivers. Molex plans to acquire Teramount, a provider of detachable, passive-alignment fiber-to-chip connectivity solu... » read more

Chip Industry Technical Paper Roundup: Apr. 14


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations Device/circuit simulations of silicon spin qubits based on a gate-all-around transistor 🔗 Teikyo University, RIKEN Causal AI For AMS Circuit Design: Interpretable Parameter Effects Analysis 🔗 University of Florida Reliability of Wide B... » read more

AI Demand Resets Memory Market Priorities, Tightening NOR Flash Availability


The memory sector is entering a major turning point as the industry adjusts to what many now call the AI memory supercycle. Although most headlines focus on high bandwidth memory (HBM) and advanced NAND fueling the rapid expansion of AI data centers, a quieter but important consequence is emerging: shifts in production priorities are beginning to affect the supply of NOR flash across a wide ra... » read more

Moving Electrons, Not Just Vehicles


Key Takeaways: There are several ways to convert AC power from the grid to DC power in the system. Some degrade the battery faster than others. Battery management systems monitor cell voltage, current, and temperature, helping to estimate state of charge, health, and useful remaining life. A PMIC with a multi-level converter is the most efficient way to get power from the battery to ... » read more

Ensuring Trustworthiness of AI-Enhanced Embedded Systems


Artificial Intelligence (AI) is unlocking new capabilities in safety-critical systems, from enhanced motor control to autonomous driving. However, integrating AI safely remains a significant challenge due to its data-driven nature and operation in open and real-world variability. While established standards such as ISO 26262 and ISO 21448 provide a foundation for functional safety and intended ... » read more

Status of WBG Device Reliability in Automotive (U. Bremen et al.)


A new technical paper, "Reliability of Wide Bandgap Semiconductors for Automotive Applications," was published by the Universitat Bremen, Technische Universitat Chemnitz, BMW, Robert Bosch GmbH, Infineon, Semikron Danfoss, and FH Dortmund. Abstract "Wide bandgap (WBG) semiconductor devices offer tremendous advantages over their silicon counterparts. Automotive applications benefit particu... » read more

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