Manufacturing Bits: July 10

By Mark LaPedus - 10 Jul, 2019 - Comments: 0

Semicon West It’s Semicon West time again. Here’s the first wave of announcements at the event: Applied Materials has unveiled a pair of tools aimed at accelerating the industry adoption for new memories. First, Applied rolled out the Endura Clover MRAM PVD system. The system is an integrated platform for MRAM devices. Second, the company introduced the Endura Impulse PVD platform for P... » read more

Power/Performance Bits: Jan. 2

By Jesse Allen - 02 Jan, 2019 - Comments: 0

High-temp electronics Researchers at Purdue University, UC Santa Cruz, and Stanford developed a semiconducting plastic capable of operating at extreme temperatures. The new material, which combines both a semiconducting organic polymer and a conventional insulating organic polymer could reliably conduct electricity in up to 220 degrees Celsius (428 F). "One of the plastics transports the ch... » read more

Power/Performance Bits: Sept. 6

By Jesse Allen - 06 Sep, 2016 - Comments: 0

Carbon nanotube transistors outperform silicon University of Wisconsin-Madison materials engineers created carbon nanotube transistors that outperform silicon transistors, improving the current 1.9 times. The new transistors are particularly promising for wireless communications technologies that require a lot of current flowing across a relatively small area. "This achievement has been a... » read more

Power/Performance Bits: July 7

By Jesse Allen - 07 Jul, 2015 - Comments: 0

Direct solar energy storage Storing solar energy as hydrogen is a promising way for developing comprehensive renewable energy systems. To accomplish this, traditional solar panels can be used to generate an electrical current that splits water molecules into oxygen and hydrogen, the latter being considered a form of solar fuel. However, the cost of producing efficient solar panels makes wate... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Institute for Basic Science

Manufacturing Bits: July 10

Power/Performance Bits: Jan. 2

Power/Performance Bits: Sept. 6

Power/Performance Bits: July 7