Manufacturing Bits: June 22

By Mark LaPedus - 22 Jun, 2021 - Comments: 1

5G metasurface antennas At the recent 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), the Institute of Microelectronics of the Chinese Academy of Sciences (CAS) presented a paper on a low-profile broadband metasurface antenna for 5G antenna-in-package applications. The National Center for Advanced Packaging and the University of Chinese Academy of Sciences also contri... » read more

Manufacturing Bits: March 27

By Mark LaPedus - 27 Mar, 2018 - Comments: 0

Nanostructure printers Using electron-beam lithography and reactive-ion etching techniques, Singapore’s Agency for Science, Technology and Research (A*STAR) has developed a new high-resolution color nanostructure printing system. The printer enables nanostructures made from silicon. It prints tiny structures with a wide range of colors. In the future, researchers hope that nanostructure ... » read more

Synopsys Buys Gold Standard Simulations

By Brian Bailey - 23 May, 2016 - Comments: 1

[getentity id="22035" e_name="Synopsys"] has made another quiet acquisition, this time in the TCAD space. [getentity id="22272" comment="Gold Standard Simulations (GSS)"] offers a suite of solutions for design technology co-optimization (DTCO), PDK development and exploration and screening of future technology options. Their tool chain integrates predictive Monte Carlo and statistical TCAD s... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Institute of Microelectronics

Manufacturing Bits: June 22

Manufacturing Bits: March 27

Synopsys Buys Gold Standard Simulations

Trending Articles

Hybrid Bonding Makes Strides Toward Manufacturability

Americas Chip Funding Energizes Industry

Advanced Packaging Driving New Collaboration Across Supply Chain

Chiplets Make Progress Using Interconnects As Glue

2D Semiconductors Make Progress, But So Does Silicon

Knowledge Centers
Entities, people and technologies explored