tag: Intel

What Makes RISC-V Verification Unique?
By Brian Bailey - 09 Mar, 2023 - Comments: 0

Semiconductor Engineering sat down to discuss the verification of RISC-V processors with Pete Hardee, group director for product management at Cadence; Mike Eftimakis, vice president for strategy and ecosystem at Codasip; Simon Davidmann, founder and CEO of Imperas Software; Sven Beyer, program manager for processor verification at Siemens EDA; Kiran Vittal, senior director of alliances partner... » read more

Standards: The Next Step For Silicon Photonics
By Karen Heyman - 07 Mar, 2023 - Comments: 0

Testing silicon photonics is becoming more critical and more complicated as the technology is used in new applications ranging from medicine to cryptography, lidar, and quantum computing, but how to do that in a way that is both consistent and predictable is still unresolved. For the past three decades, photonics largely has been an enabler for high-speed communications, a lucrative market t... » read more

Chip Industry’s Technical Paper Roundup: Mar. 6
By Linda Christensen - 06 Mar, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=84 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

CXL-Based Memory Pooling System Meets Cloud Performance Goals And Significantly Reduces DRAM Cost
By Technical Paper Link - 05 Mar, 2023 - Comments: 0

A technical paper titled "Pond: CXL-Based Memory Pooling Systems for Cloud Platforms" was published by researchers at Virginia Tech, Intel, Microsoft Azure, Google, and Stone Co. Abstract "Public cloud providers seek to meet stringent performance requirements and low hardware cost. A key driver of performance and cost is main memory. Memory pooling promises to improve DRAM utilization and t... » read more

Agile HW Design: Fully Automatic Equivalence Checking Workflow
By Technical Paper Link - 03 Mar, 2023 - Comments: 0

A new technical paper titled "An Equivalence Checking Framework for Agile Hardware Design" was published by researchers at Portland State University and Intel. Abstract "Agile hardware design enables designers to produce new design iterations efficiently. Equivalence checking is critical in ensuring that a new design iteration conforms to its specification. In this paper, we introduce an eq... » read more

Week In Review: Semiconductor Manufacturing, Test
By Gregory Haley - 03 Mar, 2023 - Comments: 0

Semiconductor Research Corporation (SRC) released an interim roadmap for Microelectronic and Advanced Packaging Technologies (MPAT) that targets 10- to 15-year goals for 3D integration and multi-chiplet packaging. The roadmap is open for comments. Participants in the MPAT include AMD, IBM, Intel, Texas Instruments, Purdue University, SUNY Binghamton and the Georgia Institute of Technology. It i... » read more

Week In Review: Design, Low Power
By Jesse Allen - 03 Mar, 2023 - Comments: 0

Apple plans to spend an additional €1 billion (~$1.1B) over the next six years to expand its Munich, Germany-based Silicon Design Centre, including the construction of a new research facility. "The expansion of our European Silicon Design Centre will enable an even closer collaboration between our more than 2,000 engineers in Bavaria working on breakthrough innovations, including custom sil... » read more

Week In Review: Manufacturing, Test
By Gregory Haley - 24 Feb, 2023 - Comments: 0

The U.S. is aiming for the creation of two new advanced semiconductor manufacturing facilities with “a robust supplier ecosystem” supported by the $52.7 billion CHIPS Act. Included is an $11 billion investment in semiconductor research and development, along with the creation of a new public-private partnership called the National Semiconductor Technology Center. This follows more than a do... » read more

Week In Review: Auto, Security, Pervasive Computing
By Marie C. Baca - 24 Feb, 2023 - Comments: 0

Automotive Ambarella will use Samsung's 5nm process technology for its new CV3-AD685 automotive AI central domain controller, bringing "new levels of AI acceleration, system integration and power efficiency to ADAS and L2+ through L4 autonomous vehicles.” Renesas introduced four technologies for automotive communication gateway SoCs: (1) an architecture that dynamically changes... » read more

Blog Review: Feb. 22
By Jesse Allen - 22 Feb, 2023 - Comments: 0

Siemens EDA's Harry Foster observes that the FPGA market continues to go through a similar complexity curve that the IC/ASIC market experienced in the early and mid-2000 timeframe. Synopsys' Mitch Heins explores the benefits of heterogeneous integration of lasers and active gain elements in a silicon-based photonic IC, including reduced system costs, size, weight, and power along with improv... » read more

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