tag: Intel

Week In Review: Design, Low Power
By Jesse Allen - 29 Nov, 2019 - Comments: 0

Aldec launched the HES-MPF500-M2S150 Development Kit for early co-development and co-verification of hardware and software for FPGA-based embedded systems that will use devices from either or both of Microchip’s PolarFire or SmartFusion2 families. The HES-MPF500-M2S150 Development Kit features Microchip’s low power PolarFire MPF500T FCG1152 FPGA, which has 481k logic elements, 1480 math blo... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 22 Nov, 2019 - Comments: 0

Chipmakers For some time, Intel has experienced supply constraints and shortages for its 14nm chip products. Apparently, the company is still having issues with both 14nm and 10nm. “Despite our best efforts, we have not yet resolved this challenge,” according to a statement from Michelle Johnston Holthaus, executive vice president and general manager of the Sales, Marketing and Communicati... » read more

Planning For Panel-Level Fan-out
By Mark LaPedus - 21 Nov, 2019 - Comments: 0

Several companies are developing or ramping up panel-level fan-out packaging as a way to reduce the cost of advanced packaging. Wafer-level fan-out is one of several advanced packaging types where a package can incorporate dies, MEMS and passives in an IC package. This approach has been in production for years, and is produced in a round wafer format in 200mm or 300mm wafer sizes. Fan-out... » read more

Week in Review: IoT, Security, Automotive
By SE Staff - 15 Nov, 2019 - Comments: 0

Connectivity, 5G Rambus has revealed a PCI Express 5.0 interface on advanced 7nm finFET process node for heterogenous computing aimed at performance-intensive uses, such as AI, data center, HPC, storage and 400GbE networking. With a PHY and a digital controller core recently acquired Northwest Logic, the interface has 32 GT/s (gigatransfers per second) bandwidth per lane with 128 GB/s bandwidt... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 08 Nov, 2019 - Comments: 0

Chipmakers The IC industry once had several leading-edge vendors that invested and built new fabs. But over time, the field has narrowed due to soaring costs and a dwindling customer base. In 1994, the share of semiconductor industry capital spending held by the top five companies was 25%, according to IC Insights. This meant that a number of companies invested and built new fabs during the... » read more

Week in Review: Iot, Security, Automotive
By SE Staff - 08 Nov, 2019 - Comments: 0

IoT STMicroelectronics is now supporting LoRaWAN firmware updates over the air (FUOTA) in the STM32Cube ecosystem. Microsoft is adding ANSYS Twin Builder to its Microsoft Azure Digital Twins software, which companies use to create digital twins of machinery and IoT devices that are deployed in remotely. The digital replica of actual devices helps companies predict when maintenance is needed... » read more

Blog Review: Nov. 6
By Jesse Allen - 06 Nov, 2019 - Comments: 0

Cadence's Paul McLellan considers why high-performance compute, high-performance networks, and security will all be vital to the next wave of devices and the importance of optimization. Synopsys' Taylor Armerding points to some best practices for assessing your supply chain to find the weak links that could lead to a security breach, from why to make it a priority to what to ask software ven... » read more

Migrating 3D Into The Mainstream
By Brian Bailey - 31 Oct, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss changes required throughout the ecosystem to support three-dimensional (3D) chip design with Norman Chang, chief technologist for ANSYS' Semiconductor Business Unit; John Park, product management director for IC packaging and cross-platform solutions at Cadence; John Ferguson, director of marketing for DRC applications at Mentor, a Siemens Business;... » read more

Blog Review: Oct. 30
By Jesse Allen - 30 Oct, 2019 - Comments: 0

Cadence's Paul McLellan checks out the future of the automotive industry, the options for making the transition to autonomous driving, and how experience with electric vehicles influences perception of them. In a video, Mentor's Colin Walls digs into the challenges of testing memory in an embedded system. A Synopsys writer looks at doubling bandwidth in PCIe 5.0, the PHY logical changes a... » read more

Week In Review: Design, Low Power
By Jesse Allen - 25 Oct, 2019 - Comments: 0

ANSYS will acquire Dynardo, a provider of simulation process integration and design optimization (PIDO) technology. Dynardo's tools include algorithms for optimization, uncertainty quantification, robustness, scenario variation, sensitivity analysis, simulation workflow building and data mining. Based in Weimar, Germany, Dynardo was founded in 2001 and has been an ANSYS software partner; the ac... » read more

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