tag: Intel

Accelerating Endpoint Inferencing
By Kevin Fogarty - 06 Jun, 2019 - Comments: 0

Chipmakers are getting ready to debut inference chips for endpoint devices, even though the rest of the machine-learning ecosystem has yet to be established. Whatever infrastructure does exist today is mostly in the cloud, on edge-computing gateways, or in company-specific data centers, which most companies continue to use. For example, Tesla has its own data center. So do most major carmake... » read more

Adding Order And Structure To Verification
By Brian Bailey - 30 May, 2019 - Comments: 0

You can't improve what you can't measure, and when it comes to methodologies the notion of measurement becomes more difficult. Add in notions of the skills, capabilities and experience levels of individuals within an organization, which may affect their ability to adopt certain technologies, and it requires considerable attention. This is where concepts such as capability maturity models (CM... » read more

Blog Review: May 29
By Jesse Allen - 29 May, 2019 - Comments: 0

Cadence's Meera Collier traces the evolution of computing through the series of bottlenecks the industry has needed to overcome and what's being done to address the latest one. Mentor's Rebecca Lord checks out the use of differential signals to mitigate the effects of electromagnetic interference, noise, and crosstalk in PCBs. Synopsys' Taylor Armerding considers whether Ireland's slow en... » read more

Week In Review: Design, Low Power
By Jesse Allen - 24 May, 2019 - Comments: 0

M&A Marvell will acquire Avera Semiconductor, the ASIC business of GlobalFoundries, for $650 million in cash at closing plus an additional $90 million in cash if certain business conditions are satisfied within the next 15 months. The agreements include transfer of Avera's revenue base, strategic design wins with infrastructure OEMs, and a new long-term wafer supply agreement between Globa... » read more

3D NAND Race Faces Huge Tech And Cost Challenges
By Mark LaPedus - 23 May, 2019 - Comments: 8

Amid the ongoing memory downturn, 3D NAND suppliers continue to race each other to the next technology generations with several challenges and a possible shakeout ahead. Micron, Samsung, SK Hynix and the Toshiba-Western Digital duo are developing 3D NAND products at the next nodes on the roadmap, but the status of two others, Intel and China’s Yangtze Memory Technologies Co. (YMTC), is les... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 17 May, 2019 - Comments: 0

Market research In terms of overall IC sales, Intel has replaced Samsung as the number one quarterly semiconductor supplier in 4Q18 after losing the lead spot to Samsung in 2Q17, according to IC Insights. “While Samsung held the full-year number one ranking in 2017 and 2018, Intel is forecast to easily recapture the number one ranking for the full-year of 2019, a position it previously held ... » read more

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 17 May, 2019 - Comments: 0

Internet of Things Verizon Communications launched its nationwide narrowband Internet of Things network, saying it covers more than 92% of the U.S. population. “There is a whole universe of smart solutions needing scalable and affordable connections,” Jeffrey Dietel, senior vice president of business marketing and products, said in a statement. “By launching our NB-IoT network, Verizon i... » read more

Can The Hardware Supply Chain Remain Secure?
By Andy Patrizio - 15 May, 2019 - Comments: 2

Malware in computers has been a reality since the 1990s, but lately the focus has shifted to hardware. So far, the semiconductor industry has been lucky because well-publicized threats were either limited or unproven. But sooner or later, luck runs out. Last year saw two significant incidents that shook people’s faith in the integrity of hardware security. The first was the Meltdown/Spectr... » read more

System Bits: May 14
By Jeff Dorsch - 14 May, 2019 - Comments: 0

Faster U.S. supercomputers on the way The U.S. Department of Energy awarded a contract for more than $600 million to Cray for an exascale supercomputer to be installed at the Oak Ridge National Laboratory during 2021. Cray will provide its Shasta architecture and Slingshot interconnect for what is dubbed the Frontier supercomputer. Advanced Micro Devices will have a key role in building the... » read more

Chiplet Momentum Builds, Despite Tradeoffs
By Brian Bailey - 13 May, 2019 - Comments: 0

Chip design is a series of tradeoffs. Some are technical, others are related to cost, competitive features or legal restrictions. But with the nascent 'chiplet' market, many of the established balance points are significantly altered, depending on market segments and ecosystem readiness. Chiplets provide an alternative mechanism for integrating intellectual property (IP) blocks into a semico... » read more

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