tag: interconnect

Wafer-Scale vs. Chiplets: The New War? Part 1
By Nandan Nayampally - 28 May, 2026 - Comments: 0

Cerebras’ IPO is a meaningful moment for the semiconductor industry — and not just for the financial implications. Their confidence in their opening price reflects something the industry has effectively acknowledged: incremental chip scaling can no longer keep pace with what AI infrastructure demands. Radical approaches are earning serious consideration and serious capital. Cerebras... » read more

How To Streamline Your Advanced Package Interconnect Designs
By Maria Castillo - 30 Apr, 2026 - Comments: 0

Monolithic system-on-chip (SoC) designs was once a popular choice. However, they face significant constraints in the era of AI. By forcing all chip functions into a single die and process node, they reduce engineering, manufacturing, and design cost flexibility. In contrast, the multi-die nature of chiplets enables different SoC functions to be designed and verified independently and fabrica... » read more

Chiplet-to-Chiplet Gateway Architecture, A C2C Interface Bridging Two Chiplet Protocols (Peter Grünberg, Jülich Supercomputing Centre)
By Technical Paper Link - 31 May, 2025 - Comments: 0

A new technical paper titled "Modeling Chiplet-to-Chiplet (C2C) Communication for Chiplet-based Co-Design" was published by researchers at Peter Grünberg Institute and Jülich Supercomputing Centre. Abstract "Chiplet-based processor design, which combines small dies called chiplets to form a larger chip, enables scalable designs at economical costs. This trend has received high attention s... » read more

Multi-Die Health And Reliability: UCIe Advances
By Faisal Goriawalla - 06 Mar, 2025 - Comments: 0

Although multi-die designs — an increasingly popular approach for integrating heterogeneous and homogenous dies into a single package — help resolve problems related to chip manufacturing and yield, they introduce a host of complexities and variables that must be addressed. In particular, designers must work diligently to ensure the health and reliability of their multi-die chip throughout ... » read more

Optimization of the Inter-Chiplet Interconnect And The Chiplet Placement (ETH Zurich, U. of Bologna)
By Technical Paper Link - 04 Feb, 2025 - Comments: 0

A new technical paper titled "PlaceIT: Placement-based Inter-Chiplet Interconnect Topologies" was published by researchers at ETH Zurich and University of Bologna. Abstract "2.5D integration technology is gaining traction as it copes with the exponentially growing design cost of modern integrated circuits. A crucial part of a 2.5D stacked chip is a low-latency and high-throughput inter-ch... » read more

Managing Reflections With Terminations
By John Golding - 04 Nov, 2024 - Comments: 0

Have you heard recommendations to use a particular termination in particular situations for good signal integrity? Have you ever wondered how to incorporate terminations in your design? While there are typical use cases for various terminations, sometimes engineers use termination techniques based on a recommendation or assumption that may not work, or at least may not be optimal, for their par... » read more

CXL Thriving As Memory Link
By Karen Heyman - 16 Sep, 2024 - Comments: 0

CXL is emerging from a jumble of interconnect standards as a predictable way to connect memory to various processing elements, as well as to share memory resources within a data center. Compute Express Link is built on a PCI Express foundation and supported by nearly all the major chip companies. It is used to link CPUs, GPUs, FPGAs, and other purpose-built accelerators using serial communic... » read more

Streamlining Complex Semiconductor Designs With IP-XACT-Based Structured Assembly
By Insaf Meliane - 29 Aug, 2024 - Comments: 0

Semiconductor design is rapidly evolving because technologies such as AI and machine learning (ML) applications push the boundaries of complexity and specialization. Modern chips require hundreds or thousands of IP blocks, leading to significant design challenges. Multi-die architectures, which distribute functional blocks across multiple dice, demand expert planning to ensure connectivity and ... » read more

Why Are Automotive SoC Designers Turning To PCI Express 6.0?
By Richard Solomon - 07 Dec, 2023 - Comments: 0

Just over two decades ago, the introduction of PCI Express 1.0 marked the industry’s transition from then-ubiquitous parallel to serial interfaces. Back in 2002, the potential of “PCIe” in automotive applications was unforeseen – given the then-current state of in-vehicle computation and PCIe’s primary focus on desktop and data center use. Today, however, with the advent of connected ... » read more

Nascent Chiplet Tech Gaining Attention In Defense and Commercial Industries
By Ben Miller - 30 Nov, 2023 - Comments: 0

The economic benefits derived from Moore's Law have changed, and not for the better. This shift – especially on the manufacturing side of system-on-chip (SoC) devices, has both the defense and commercial customers in the semiconductor industry wondering what will come next. One way to extend Moore's Law's cost, feature, and size benefits is with multi-chip technology, now commonly known as... » read more

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