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Optimizing NoC-Based Designs


Semiconductor development is currently in a phase of rapid evolution driven by the combination of new technologies and methodologies. The technique of combining multiple functions into systems-on-chips (SoCs) is continuing to grow in complexity. Rapid advancement in new technologies for market segments like data centers, robotics, ADAS and artificial intelligence/machine learning (AI/ML) are re... » read more

Choosing The Right Server Interface Architectures For High Performance Computing


The largest bulk and cost of a modern high-performance computing (HPC) installation involves the acquisition or provisioning of many identical systems, interconnected by one or more networks, typically Ethernet and/or InfiniBand. Most HPC experts know that there are many choices between different server manufacturers and the options of form factor, CPU, RAM configuration, out of band management... » read more

UCIe: Marketing Ruins It Again


You may have seen the press release and articles recently about a new standard called UCIe. It stands for Universal Chiplet Interconnect Express. The standard is a great idea and will certainly help the market for chiplet-based designs to advance. But the name — Argggh. More on that later. First, let's talk about what it is. You may notice the name looks similar to PCIe (Peripheral Compone... » read more

A review of interconnect materials used in emerging memory device packaging: first- and second-level interconnect materials


Abstract "The main motivation of this review is to study the evolution of first and second level of interconnect materials used in memory device semiconductor packaging. Evolutions of bonding wires from gold (Au) to silver (Ag) or copper (Cu) have been reported and studied in previous literatures for low-cost solution, but Au wire still gives highest rating in terms of the performance of tempe... » read more

NoC Experiences From The Trenches


Network-on-chip (NoC) interconnect as an alternative to traditional crossbars is already well-proven, but there are still plenty of design teams on the cusp of a transition or who maybe do not yet see a need for a change. As with a switch to any new technology, the first hurdles are often simply misconceptions. When new users first evaluate any new technology, they often make the mistake of att... » read more

Advancing To The 3nm Node And Beyond: Technology, Challenges And Solutions


It seems like yesterday that finFETs were the answer to device scaling limitations imposed by shrinking gate lengths and required electrostatics. The introduction of finFETs began at the 22nm node and has continued through the 7nm node. Beyond 7nm, it looks like nanosheet device structures will be used for at least the 5nm and probably the 3nm nodes. The nanosheet device structure is the brainc... » read more

SoC Integration Complexity: Size Doesn’t (Always) Matter


It’s common when talking about complexity in systems-on-chip (SoCs) to haul out monster examples: application processors, giant AI chips, and the like. Breaking with that tradition, consider an internet of things (IoT) design, which can still challenge engineers with plenty of complexity in architecture and integration. This complexity springs from two drivers: very low power consumption, eve... » read more

CXL: Sorting Out The Interconnect Soup


In the webinar Hidden Signals: Memory and Interconnect Decisions for AI, IoT and 5G, Shane Rau of IDC and Rambus Fellow Steven Woo discussed how interconnects were a critical enabling technology for future computing platforms. One of the major complications was the “interconnect soup” of numerous and divergent interface protocols. The Compute Express Link (CXL) standard offers to sort out m... » read more

Die-To-Die Stress Becomes A Major Issue


Stress is becoming more critical to identify and plan for at advanced nodes and in advanced packages, where a simple mismatch can impact performance, power, and the reliability of a device throughout its projected lifetime. In the past, the chip, package, and board in a system generally were designed separately and connected through interfaces from the die to the package, and from the packag... » read more

The Role Of NoCs In System-Level Services


The primary objective of any network-on-chip (NoC) interconnect is to move data around a chip as efficiently as possible with as little impact as possible on design closure while meeting or exceeding key design metrics (PPA, etc.). These networks have become the central nervous system of SoCs and are starting to play a larger role in system-level services like quality of service (QoS), debug, p... » read more

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