Security Is Critical For Commercial Chiplets

By Ann Mutschler - 13 Mar, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about the security issues and requirements in commercial chiplet ecosystem, with Frank Schirrmeister, vice president solutions and business development at Arteris; Mayank Bhatnagar, product marketing director in the Silicon Solutions Group at Cadence; Paul Karazuba, vice president of marketing at Expedera; Stephen Slater, EDA prod... » read more

Chiplet IP Standards Are Just The Beginning

By Ann Mutschler - 06 Mar, 2024 - Comments: 2

Experts at the Table: Semiconductor Engineering sat down to talk about chiplet standards, interoperability, and the need for highly customized AI chiplets, with Frank Schirrmeister, vice president solutions and business development at Arteris; Mayank Bhatnagar, product marketing director in the Silicon Solutions Group at Cadence; Paul Karazuba, vice president of marketing at Expedera; Stephen S... » read more

Commercial Chiplet Ecosystem May Be A Decade Away

By Ann Mutschler - 29 Feb, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about the challenges of establishing a commercial chiplet ecosystem with Frank Schirrmeister, vice president solutions and business development at Arteris; Mayank Bhatnagar, product marketing director in the Silicon Solutions Group at Cadence; Paul Karazuba, vice president of marketing at Expedera; Stephen Slater, EDA product mana... » read more

Why Matter 1.0 Really Matters

By Ed Sperling - 05 Dec, 2022 - Comments: 0

Incompatibilities of consumer devices inside the home are frustrating for consumers and a security risk. Skip Ashton, distinguished engineer at Infineon, talks about how the Matter 1.0 standard will fuse together different ecosystems from companies such as Apple, Google, and Amazon, how it will be applied to existing devices, what’s included and missing from the standard today, and how it can... » read more

Brokerage System for Integration of LrWPAN Technologies

By Technical Paper Link - 01 Apr, 2022 - Comments: 0

New academic paper from UK's Leeds Beckett University. Abstract "The prevalent demand for remote data sharing and connectivity has catalysed the development of many wireless network technologies. However, low-power and low-rate wireless network technologies have emerged as the preferred choice (due to cheap procurement and maintenance cost, efficiency, and adaptability). Currently, these gr... » read more

Synopsys SoundWire Test Suite

By Synopsys - 08 Mar, 2017 - Comments: 0

Validation and interoperability are always a challenge for any new protocol. An earlier white paper, Digital Audio Simplified: MIPI SoundWire, discussed the basics of digital audio transmission, and benefits of SoundWire over other audio interfaces. This whitepaper describes how easy it is to integrate and validate a SoundWire design using Synopsys SoundWire VIP Test Suite. To read more, cli... » read more

Anatomy Of The HDMI IP Certification Flow

By Synopsys - 09 Sep, 2015 - Comments: 0

HDMI IP plays a critical role in enabling HDMI 2.0 features, making 60 frames per second UHD video and audio possible in multimedia SoCs. SoC designers can avoid costly functionality and interoperability issues by selecting and integrating HDMI IP that has gone through an extensive multi-phase testing process and achieved certification. This white paper outlines the HDMI IP certification flow f... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer