tag: IPC

A Novel Power-Saving Reversing Camera System with Artificial Intelligence Object Detection
By Technical Paper Link - 20 Apr, 2022 - Comments: 1

Abstract "According to a study by the Insurance Institute for Highway Safety (IIHS), the driving collision rate of using only the reversing camera system is lower than that of using both the reversing camera system and the reversing radar. In this article, we implemented a reversing camera system with artificial intelligence object detection to increase the information of the reversing image... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 28 Jan, 2022 - Comments: 0

Government policy As reported, the United States is in dire need of more fab capacity as well as packaging plants. The U.S. took a big step in an effort to solve the problem. The U.S. House of Representatives this week introduced the America Competes Act of 2022. The bill includes funding for the Creating Helpful Incentives to Produce Semiconductors for America (CHIPS) Act, which is earmarked... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 14 Jan, 2022 - Comments: 0

Chipmakers, OEMs TSMC reported sales of $15.736 billion for the fourth quarter of 2021, up 5.7% sequentially. Net income grew 6.4% quarter-over-quarter. In the fourth quarter, shipments of 5nm accounted for 23% of total wafer revenues, while 7nm accounted for 27%. In the first quarter of 2022, TSMC’s sales are expected to be between $16.6 billion to $17.2 billion. TSMC also expects its 20... » read more

Expanding Advanced Packaging Production In The U.S.
By Mark LaPedus - 05 Jan, 2022 - Comments: 0

The United States is taking the first steps toward bringing larger-scale IC packaging production capabilities back to the U.S. as supply chain concerns and trade tensions grow. The U.S. is among the leaders in developing packages, especially new and advanced forms of the technology that promise to shake up the semiconductor landscape. And while the U.S. has several packaging vendors, North A... » read more

Electronics Supply-Chain Trust Standards Emerge
By Bryon Moyer - 07 Jan, 2021 - Comments: 0

Creative new ideas for electronics supply-chain trust are in rich supply, whether securing identity, protecting logistics, or establishing provenance. But underlying these efforts are wide-ranging standards in development from a broad set of organizations. Today, no one-stop-shop for supply-chain standards exists. Instead, there is huge fragmentation. It can be difficult to identify all of t... » read more

Blockchain Attempts To Secure The Supply Chain
By Bryon Moyer - 03 Dec, 2020 - Comments: 0

Blockchain technology is starting to be deployed more widely In the battle against counterfeiting, often coupled with component IDs to allow device authentication. Securing the supply chain is a complex challenge, particularly as more IP from more vendors in more locations makes its way into chips, packages or even systems. Being able to attest to the history of the device to prove its prove... » read more

Uniquely Identifying PCBs, Subassemblies, And Packaging
By Bryon Moyer - 18 Nov, 2020 - Comments: 0

Securing the semiconductor supply chain is becoming much more difficult as devices increasingly are disaggregated, a shift being forced on the industry due to the rising cost of scaling and the need for more customization and faster time to market. Individual component IDs are an important starting point for supply chain trust, but they are no longer sufficient. Those components will end up ... » read more

The Expanding Universe Of MIPI Applications
By Joseph Rodriguez - 12 Nov, 2020 - Comments: 0

It’s hard to imagine today, but there was a time when mobile phones had no cameras and displays were tiny monochrome LCDs capable of displaying a phone number and not much more. The iconic Nokia 3310 announced Sept. 1, 2000, had an 84 x 48 pixel monochrome display and went on to sell 126 million units worldwide. You may still have one in your junk drawer. By the time of the original iPhone... » read more

Demand Grows For Reducing PCB Defects
By Anne Meixner - 13 Oct, 2020 - Comments: 0

Board manufacturers are boosting their investment in inspection, test and analytics to meet the increasingly stringent demands for reliability in safety-critical sectors like automotive. This represents a significant shift from the past, where concerns about reliability primarily targeted the devices connected to printed circuit boards. But as SoCs become disaggregated into advanced packages... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 28 Feb, 2020 - Comments: 2

SPIE At the SPIE Advanced Lithography conference, Lam Research has introduced a new dry resist technology for extreme ultraviolet (EUV) lithography. Dry resist technology is a new approach to deposit and develop EUV resists. It is a dry deposition technique with alternate compositions and mechanisms. By combining Lam’s deposition and etch process expertise with partnerships with ASML a... » read more

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