The Week In Review: Manufacturing

By Mark LaPedus - 01 May, 2015 - Comments: 0

After several delays due to a myriad of complex regulatory issues, Applied Materials’ proposed deal to buy Tokyo Electron Ltd. (TEL) has been scrapped. Now, Applied Materials and TEL are separately re-grouping, and are back to where they originally started as competitors in the fab tool market. Applied Materials held a conference call to explain the situation with TEL. Applied Materials... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 03 Apr, 2015 - Comments: 0

Suppliers in the automotive semiconductor market experienced exceptional growth in 2014, according to IHS. Based on final analysis of the 2014 results, Renesas maintained its leadership position as the number one supplier in 2014, according to the rankings. “For 2015, IHS expects to see a shift among the leading suppliers in this category, given the recent merger of Freescale and NXP, two lar... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 22 Aug, 2014 - Comments: 0

Gartner has released a chart, which tracks the “Hype Cycle for Emerging Technologies in 2014.” According to the chart, here’s some of the technologies that are still a number of years away from reaching the marketplace: virtual personal assistants; human augmentation; brain-computer interface; quantum computing; smart robots; biochips; smart advisors; autonomous vehicles; and natural-lang... » read more

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Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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The Week In Review: Manufacturing

The Week In Review: Manufacturing

The Week In Review: Manufacturing